| Iphone 4s ic's have black glue under them. To reheat/Reflow will result in most of the time in a shortcut. Since the soldering balls under the ic will jump like popcorn and connect with each. Reballing is the best. You can try to reflow at low temperature 350 degrees celcius For 10 seconds..too little heat will not let the soldering flow and to high will result in a shortcut. it could be what < Best > is suggesting. That the power manager doesnt power the nand. |