| Col-l29 frp ok
Device detected:
COM147: HUAWEI USB COM 1.0 (COM147)
BOOTLOADER File to update: Kirin970_T2_A8.0_V3
3. 5. 2019 13:53:46 Starting to write device...
Writing bootloader...
Writing Kirin970_T2_A8.0_V3_3.dtwork...
Writing Kirin970_T2_A8.0_V3_4.dtwork...
Writing Kirin970_T2_A8.0_V3_5.dtwork...
Waiting for fastboot device...
Device found: CLCDU18A23001003
Looking for a device in fastboot mode
Device found: CLCDU18A23001003
Getting IMEI...
Getting build number...
Getting model ...
Getting battery state...
Getting backdoor info...
Getting lock state info...
Getting lock boot info...
SN:CLCDU18A23001003
IMEI:864439045887283
IMEI1:864439045907792
MEID:00000000000000
Build number: :COL-L29 9.0.0.207(C432E4R1P12)
Model: COL-L29
Battery state: 0
OEM lock state info:
FB LockState: UNLOCKED
USER LockState: LOCKED
OEM get bootinfo:
unlocked
Unlocking FRP...
Writing FRP partition
FRP partition UPDATE :FAIL partition error
Writing FRP partition
FRP partition UPDATE ...OK
Software written
3. 5. 2019 13:54:39 Writing device finished OK |