Quote:
Originally Posted by Dan Collins  That is correct and the same reason that reflows most often do not last. BGA has been exposed to too much heat. Although I have been successful reusing G6150's from mobo's that failed from non heat issues.
I am close to setting up a G6150 test bed. I must have over a hundred pulls that I do not want to reball and use unless I know they are good chips. My test bed will have a flip top socket on a test motherboard I can test the graphic features and the heat dissipation to insure the chip is good before I use it. Another nice feature is to insure the new chips also are good before use. There is nothing worse than to go through the time and thermal cycles only to install a defective BGA. |
I want to do the same project for the G86 750 A2, but it is very careful, do you have pictures of your adapter?
many thanks