I have changed meny gluted Ic not only UEM`s. My solution is surface grinder or litle 9V power supply boring mashine with grinderstone. Just grind off your Ic: layer after layer till you will see balls from the PCB, when you have grinded your Ic realy flat then you can try to solder your Ic on this grinded balls but that is no 100% solution. Better is if you remove all glue, with hot air station. Set temperature near 180 C degrees and slowly remove glue between bals, dont increase temp becuse you can damage tracks ond pcb. 180 C degrees is perfect temp because dont dissolve fast tins balls and you can remove almost all glue, main essential thing is to remove the biggest glue pieces. After that you can remove rest of glue and tins using Plato-Wick but very queasily. After that you can solder new Ic, with this metod I have repaired more than 20 pcs of phones, 6310 in most cases. Till I have founded solution i have dstroyed 6 pcs of 6310 and one 6100 all with gluted UEM`s.
First time it takes long, but if you learn this solutin it goes very easy and fast. Now i need maximum 15-20 to change gluted IC. On the beginnng i tried to pick up gluted Ic in many ways but always PCB was damage, one or two tracks were broken. Plese post your results, Im curios that my solution is working. When someone dont belive i can post photos.
BeSt ReGreeDs
BoDziO
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