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Originally Posted by thecult @Bodzio: Interesting... but you never destroy pads with the grinder?
I use other method, but not safe... with wnife and hot air... insert knife behind glue and ic... and pull up. (15% times broke pad) and after, remove glue with knife and 180º (like u)
b.r. |
No, because I never grind so much till PCB, I leave small layer of glue on PCB, then I remove this slowly with Plato-Wick, you can also remove tin just after you grind off entire Ic with with soldering station. Then your balls are small uder glue and you can scarier grind off glue.
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