usually i use 200°C measured on the BGA, then put some gel flux around the IC, wait some sec, then use a nail and scrap all the glue around the IC. Then the heat will better goes under the IC, you will need a lower temp to lift the bga then.
If you can see the nearby component solder melting, try to gently move the BGA, if not wait some sec and retry! try also to lift it with a tweezer or something else, but pry it gently
