View Full Version : Motorola L2000 Problems
Hanukkah
07-27-2001, 03:54
I have a Mot L2000. I checked the bat terminals with x1 range on tester. + probe on + term and - probe on - terminal -- needle deflects. Switching the probes -- the needle deflects and stays deflected. This means the PA is shorted right?
Another problem is the unit is not charging. Should I assume that all these symptons point to a shorted PA?
:rolleyes:
Hello
as your problem , it's not P.A shorted , it seems your GCAP damaged , GCAP is the controler for charging,power,voice etc. :)
Hanukkah
07-27-2001, 05:48
Thanks Bert.
This GCAP, is this the 8 pin IC directly below the Power IC. IF not could you tell me where it is. Thanks. Also can you tell me where I can buy parts there in HK as I might travel there sometime soon. Thanks Again. ;)
Hi<br />No, it's not the 8 pin device it's a uBGA I.C the marking like 79Exx , if you want to visit HK you can try to contact me <img src="smile.gif" border="0"> good luck!
JammerOne
07-31-2001, 15:22
Hallo BERT...
<br /> Can you help me about the Tools. like BGA there are so many people said that in Hong Kong there are so many Tools for CellPhone..
JammerOne
Hello<br />You can buy that tools from CHina but the main problem is the soldering skill not the equipment. <img src="smile.gif" border="0">
Pandemonio100
07-31-2001, 20:21
If you want rework the BGA components you have to use infrared solder (ERSA IR500 the BEST) price is aprox. 5300USD in Italy. Whit this welder to infrared you can make all the components that you want SMT/Fine Pitch/BGA/Thru-Hole. <img src="wink.gif" border="0">
Hum? <img src="smile.gif" border="0"><br />Our service centre also have such IR machine but that just for centre certifycation , our engineer and me usually just use hot air gun to solder that <img src="smile.gif" border="0"> without any problem.
[ 31 July 2001: Message edited by: Bert ]</p>
Pandemonio100
08-02-2001, 19:56
Yes Bert also me use hot air but when you have to replace the chip you can't use Hot air. <img src="wink.gif" border="0">
Nope, I can use hot air to solder the uBGA I.C ( not remove the I.C) <img src="smile.gif" border="0"> but you must do it very carefuly. so far without any problem for me <img src="smile.gif" border="0">
Pandemonio100
08-04-2001, 11:42
Yes correct, I have tried to remove a component BGA wiht hot air and resolder but it is a lot of difficulty, I have succeeded only on startac 130<br />Flash and Ram (you know when gives the problem of resetting).<br />I think solder BGA is only for experienced in reparation. <img src="wink.gif" border="0">
Hanukkah
08-05-2001, 10:44
Bert can you tell me where i can buy those parts? E-mail me you number and maybe we can work something out. Thanks