yosalynn
04-17-2008, 11:18
USAGE：
Suit for most desoldering of SMD, such as: SOIC、CHIP、QFP、PLCC、BGA, ETC.. ( Applying to the mobile phone flex and flex seat specially solders).
Characteristic：
1、Stainless Steel Shell；
2、Mcu Intelligent Drive， Lcd Display；
3、Double Power 35w/50w；
4、Timing Set（0-420secs）,Memory Function；
5、Leak Proof Cover Design；
http://www.hengwei168.com/WebEditor/UploadFile/200837112535433.jpg
Suit for most desoldering of SMD, such as: SOIC、CHIP、QFP、PLCC、BGA, ETC.. ( Applying to the mobile phone flex and flex seat specially solders).
Characteristic：
1、Stainless Steel Shell；
2、Mcu Intelligent Drive， Lcd Display；
3、Double Power 35w/50w；
4、Timing Set（0-420secs）,Memory Function；
5、Leak Proof Cover Design；
http://www.hengwei168.com/WebEditor/UploadFile/200837112535433.jpg