Wings
05-27-2003, 12:44
Good day
H-S BGA IC GLUE REMOVING LIQUID
Application : BGA IC Glue Removing Liguid softens and removes
quickly BGA IC sealing glue of mobile phones.
Storage : Avoid light, open fire, high heat and clashing.
1- Use a tweezers to pick carefully a piece of square absorbent
cotton with bigger size then BGA IC and dip it with the Glue
Removing Liguid, then cover it evently to the BGA IC chip in need
of glue removing .
2- Use a small plastic bag to cover the whole mobile phone main-
board, seal it and put it horizontally for 30 minutes , if the
application time is longer, the softening effect is better.
3- Under magnifying glass lamp, use a tweezers to remove the
softened sealing glue in the out side of BGA IC ship , when r
emoving please pay please pay attention to avoid damaging
circuits surrounding BGA.
4- Install BGA specified nozzle to thermostatic soldering remover .
the temperature will be a adjusted to 280c-320c .The nozzle is
4-6 mm from BGA IC, heating BGA IC slowly after the soldering tim
is melted , use a vacuum absord pen to lift BGA IC carefully and
clear it .(also you can use a tweezer)
5- If there is remained sealing glue in the cleared BGA IC , put it
into the glue Removing liquid bottle to dip for 20 minutes so as
to enable complete softering of the sealing glue . Clear it with a
brush , then use one anti-static electricity supersonic cleaner for
cleaning .
6- Finally, use specified board - cleaning water to clean the glue
Removing liguid remained on the main - board .
This solution is tested 1000 % by us and our friends .
1 bottel is 40$ ..... 5 + another price
Shippment world wide with
www.dhl.com
www.tnt.com
for more information regarding this new solution feel free to contact me on ICQ .
www.1141.net
www.1141server.net
Or by email
Best Regards
http://www.telempire.com/~pub/liquid3.jpg
H-S BGA IC GLUE REMOVING LIQUID
Application : BGA IC Glue Removing Liguid softens and removes
quickly BGA IC sealing glue of mobile phones.
Storage : Avoid light, open fire, high heat and clashing.
1- Use a tweezers to pick carefully a piece of square absorbent
cotton with bigger size then BGA IC and dip it with the Glue
Removing Liguid, then cover it evently to the BGA IC chip in need
of glue removing .
2- Use a small plastic bag to cover the whole mobile phone main-
board, seal it and put it horizontally for 30 minutes , if the
application time is longer, the softening effect is better.
3- Under magnifying glass lamp, use a tweezers to remove the
softened sealing glue in the out side of BGA IC ship , when r
emoving please pay please pay attention to avoid damaging
circuits surrounding BGA.
4- Install BGA specified nozzle to thermostatic soldering remover .
the temperature will be a adjusted to 280c-320c .The nozzle is
4-6 mm from BGA IC, heating BGA IC slowly after the soldering tim
is melted , use a vacuum absord pen to lift BGA IC carefully and
clear it .(also you can use a tweezer)
5- If there is remained sealing glue in the cleared BGA IC , put it
into the glue Removing liquid bottle to dip for 20 minutes so as
to enable complete softering of the sealing glue . Clear it with a
brush , then use one anti-static electricity supersonic cleaner for
cleaning .
6- Finally, use specified board - cleaning water to clean the glue
Removing liguid remained on the main - board .
This solution is tested 1000 % by us and our friends .
1 bottel is 40$ ..... 5 + another price
Shippment world wide with
www.dhl.com
www.tnt.com
for more information regarding this new solution feel free to contact me on ICQ .
www.1141.net
www.1141server.net
Or by email
Best Regards
http://www.telempire.com/~pub/liquid3.jpg