Bga - GSM-Forum

dman · 11-08-2003, 16:20

please what is the meaning of BGA?

yp_Online · 11-21-2003, 07:44

BGA stands for Ball Grid Array, it simply means that the solder connection points joining the memory chips to the module board are spaced over a grid rather than is a straight line (like the traditional memory chips). This BGA assembly technique is used on select high-speed PC100 / PC133 & PC2100 modules. This design feature reduces the cross talk of signal information and allows for better routing of the traces. The net result is a memory that is more stable, runs cooler and works better with high speed CPUs. The problem with building BGA memory is that the modules need to be assembled with x-ray guided assembly machines because the solder contact points are underneath the DRAM chip. These newer x-ray guided placement machines eventually will be the norm however today they are very expensive and few memory module companies are willing or able to scrap their existing machines.

garutech · 11-29-2003, 18:56

Yes , yp_online u are correct BGA means BALL GRIND ARRAY.

11-08-2003, 16:20	#1 (permalink)
dman Junior Member Join Date: Nov 2003 Posts: 2 Member: 43634 Status: Offline Thanks Meter: 0	Bga please what is the meaning of BGA?

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
Bga kit rebbal for new bga .....	sergioems	Hardware Equipments for GSM	12	11-18-2004 11:22
BGA solder balls/BGA reballing kits	Eisdieler	Wanted Products	0	09-23-2003 09:26
SALE LCDS HOT AIR PENCILS BGA TOOL KITS	coolgsm2000	Hardware Repair Item Wanted	28	07-08-2003 19:47
BGA tool needed.	emix	Main Sales Section	2	02-05-2002 18:19
BGA TOOLKITS	nokya	Hardware Equipments for GSM	4	09-11-2001 06:45

11-21-2003, 07:44	#2 (permalink)
yp_Online Junior Member Join Date: Oct 2003 Location: Pakistan Age: 45 Posts: 6 Member: 42124 Status: Offline Thanks Meter: 0	BGA stands for Ball Grid Array, it simply means that the solder connection points joining the memory chips to the module board are spaced over a grid rather than is a straight line (like the traditional memory chips). This BGA assembly technique is used on select high-speed PC100 / PC133 & PC2100 modules. This design feature reduces the cross talk of signal information and allows for better routing of the traces. The net result is a memory that is more stable, runs cooler and works better with high speed CPUs. The problem with building BGA memory is that the modules need to be assembled with x-ray guided assembly machines because the solder contact points are underneath the DRAM chip. These newer x-ray guided placement machines eventually will be the norm however today they are very expensive and few memory module companies are willing or able to scrap their existing machines.

11-29-2003, 18:56	#3 (permalink)
garutech No Life Poster Join Date: Aug 2003 Location: NIGERIA, GHANA, FOSHAN Posts: 678 Member: 65222 Status: Offline Sonork: 100.65030 Thanks Meter: 59	Yes , yp_online u are correct BGA means BALL GRIND ARRAY.