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06-04-2002, 16:08
| #1 (permalink) |
| No Life Poster   Join Date: Apr 2002 Location: The Green Mile
Posts: 3,653
Member: 11325 Status: Offline Thanks Meter: 266 | BGA resoldering help just wish to ask for soem advice and hints on BGA soldering. Maybe some pictures or diagrams. I know i am being too demanding but i need some visual help on this. I got he BGA tool kit and some solder paste too but need to master the art that many of the masters have. Need to follow some guidelines further to corect the mistakes i am doing example time to allow the paste on chip, some tricks to follow etc. Thanks a lot my friends for the help br alv |
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06-07-2002, 17:59
| #2 (permalink) |
| No Life Poster  Join Date: Apr 2002 Location: Radiometer Medical ApSBrønshøj Age: 51
Posts: 721
Member: 10854 Status: Offline Sonork: 1578988 Thanks Meter: 3 | Hiya MOst importanat thing for BGA resoldering...Keep grid and slots for IC's very, VERY clean....... Clean IC with soldering ion before u start making new balls and use some NO CLEAN flux ( don't use honey flux unless it's best quality...most of honey fluxes are not for BGA and high frequencies as GSM ). Press firmly, but not to bent grid on IC, apply solder paste ( the finest the better..i use Hisatomi electric BGA paste from japan ), stab it with spatule ( don't use rubber that is supplied with most BGA kits ). Heat grid unless paste is melted and balls formed ( temp 220 oC degrees or u can use higher temp. but shorter time to avoid burning down IC ). Leave it untill cools down. Pick up grid now with IC together, put something under grid in that way IC is 3-5mm from surface, heat again untill IC drops on surface and check balls ( size and form ) when is cool with microscope.... BR Vule P.S. If u have any questions mail me .... That's all, no tricks..... |
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06-07-2002, 19:08
| #3 (permalink) |
| No Life Poster Join Date: Apr 2002 Location: The Green Mile
Posts: 3,653
Member: 11325 Status: Offline Thanks Meter: 266 | thanks mate for the suggestions you mentioned heat the grid... u mean heat oboth the stencil and chip when they are together? wont that damage teh stencil? thanks once again pal alv |
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06-08-2002, 05:10
| #4 (permalink) |
| No Life Poster Join Date: Apr 2002 Location: The Green Mile
Posts: 3,653
Member: 11325 Status: Offline Thanks Meter: 266 |  mates i have practiced quite some time now with reballing... however i am finding it really difficult in the phase to make the solder paste to stick to the chip  and so form the balls of paste.infact the stencil's holes are actually holding the paste. I cant understand why this is happening. I cleaned it the stencil so there should be no trouble. am i missing soemthing pls? thanks for your time and help mates alv |
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06-11-2002, 21:16
| #6 (permalink) |
| No Life Poster Join Date: Apr 2002 Location: Radiometer Medical ApSBrønshøj Age: 51
Posts: 721
Member: 10854 Status: Offline Sonork: 1578988 Thanks Meter: 3 | If u not short with money buy Zevac or OK International BGA rework machines....Nokia uses them...Don't ask for price....U will get heart attack...lollllll |
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