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Go Back   GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > Nokia > Nokia Hardware & Hardware Repair


Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section.

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Old 02-02-2004, 08:48   #1 (permalink)
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Make yourself BGA tin balls.


Hello all,

Try this and post result here.

1- Cut solder wire length 1 m.m. peaces [i use solder wire Alloy 63/37,dia. 0.4 m.m. flux-390, core 5B]
2- Put solder wire peaces are on a small glass wool [6" x 6" in a
matel tray] peaces aren't contact with each other.
3- **** hote air on it. set temperature that can melt solder wire.
not too much. [more temprature can melt your glass wool and it stick with ball. now your solder wire turn in to bga ball.
4- Now mess balls by bga pad, or your own way. what size of balls
you want.

[ you can change solder wire length as your requirment ]

sorry for my english

W.B.R.
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Old 02-14-2004, 20:26   #2 (permalink)
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its time consuming job. balls are readly avaliable
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Old 02-15-2004, 00:12   #3 (permalink)
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nosens... If theare no bga balls - use melt paste and BGA matrix for create it direktly on bga chip. It`s more fust and easy.
Regards.
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Old 02-15-2004, 11:07   #4 (permalink)
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Or anybody should have his own metod.
You can rehot bga then push down the chip(on board) with care,
get out the chip,if previously not seriously broken ball,you will have all balls on chip
clean the board around bga and then solder back bga
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Old 02-15-2004, 14:11   #5 (permalink)
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without ball possible to fit bga on ball, but needs some practice.......


b.r.
akki
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Old 12-17-2012, 13:54   #6 (permalink)
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BGA Solder ball making
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Old 12-17-2012, 19:01   #7 (permalink)
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dont waste time,buy several kind of staincils from the market and a P P D paste,a surgical blade .and make every ic small or big as you wish,
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