Glued UEM working solution - continuation - GSM-Forum

Bodzio · 04-29-2004, 00:48

I have changed meny gluted Ic not only UEM`s. My solution is surface grinder or litle 9V power supply boring mashine with grinderstone. Just grind off your Ic: layer after layer till you will see balls from the PCB, when you have grinded your Ic realy flat then you can try to solder your Ic on this grinded balls but that is no 100% solution. Better is if you remove all glue, with hot air station. Set temperature near 180 C degrees and slowly remove glue between bals, dont increase temp becuse you can damage tracks ond pcb. 180 C degrees is perfect temp because dont dissolve fast tins balls and you can remove almost all glue, main essential thing is to remove the biggest glue pieces. After that you can remove rest of glue and tins using Plato-Wick but very queasily. After that you can solder new Ic, with this metod I have repaired more than 20 pcs of phones, 6310 in most cases. Till I have founded solution i have dstroyed 6 pcs of 6310 and one 6100 all with glued UEM`s.
First time it takes long, but if you learn this solutin it goes very easy and fast. Now i need maximum 15-20 to change gluted IC. On the beginnng i tried to pick up gluted Ic in many ways but always PCB was damage, one or two tracks were broken. Plese post your results, Im curios that my solution is working. Here are promised photos taken yesterday:

Photo 1

Photo 2

Photo 3

Photo 4

Photo 5

BeSt ReGreeDs
BoDziO

[email protected]

ada0611 · 04-29-2004, 07:11

Links not working...

Bodzio · 04-29-2004, 07:58

If link is not working try: my yahoo group

BeSt ReGreeDs
BoDziO

[email protected]

thecult · 04-29-2004, 09:42

@Bodzio: Interesting... but you never destroy pads with the grinder?
I use other method, but not safe... with wnife and hot air... insert knife behind glue and ic... and pull up. (15% times broke pad) and after, remove glue with knife and 180º (like u)

b.r.

blue1 · 04-29-2004, 12:50

very nice discription(details)

Bodzio · 04-29-2004, 21:23

Quote:

Originally Posted by thecult

@Bodzio: Interesting... but you never destroy pads with the grinder?
I use other method, but not safe... with wnife and hot air... insert knife behind glue and ic... and pull up. (15% times broke pad) and after, remove glue with knife and 180º (like u)

b.r.

No, because I never grind so much till PCB, I leave small layer of glue on PCB, then I remove this slowly with Plato-Wick, you can also remove tin just after you grind off entire Ic with with soldering station. Then your balls are small uder glue and you can scarier grind off glue.

BeSt ReGreeDs
BoDziO

[email protected]

renejeic · 04-30-2004, 09:38

@bodzio
ur links are not working men!!!
how can i see ur pictures??

thecult · 04-30-2004, 09:49

Thanks Bodzio, I will try this week. I have Dremmel... but I want first to buy the support platform for a better precision.
@renejeic: go to his yahoo group, sign up as a member and you will download pics withouth problems

b.r.

Medz · 04-30-2004, 23:00

Quote:

Originally Posted by renejeic

@bodzio
ur links are not working men!!!
how can i see ur pictures??

Here are the Pictures in sequence..

Regards
Brs

Fonefingz · 04-30-2004, 23:36

@medz: great work!

what tool are you using?
details on actual drill "bit" and drill etc aswell would be appriciated.

keep it up man!

Medz · 05-01-2004, 02:00

@Everybody ...

Those photos are Bodzio's Photos from 1 to 5 at the top of the thread , they'r not mine ! . I restores them from my 'temporary internet files ' folder for the persons complaining from dead links

Raheeeeb · 05-01-2004, 05:31

hi.

this way is not complete safe 100% cuz it migt reach the efficincy after destroy many pcb and this is my personal cooment
1- the drill is un easy to control
2- the powder from the ic while drilling is goes every where and cuz big mess
3- the components around the uem is very small and near
4- the tip of the drill you use is very expinsive and you can use one tip every 3 or 4 ic's .
5- the old fashion ay is more safe and its take time less than drilling way take .

i m not attach hat wat but advise ppl with what i faced

br.,

Medz · 05-01-2004, 12:13

Yes I add my voice to raheeeeb's , we test it allready ourselfs ( raheeeeb & myself ).
That judjement doesnt come from nothing . Add one important thing , is that the diameter of the balls ( 0.3 mllm ) will not be equall in parallel connecting the IC to the PCB because of drimmelling variable depth from corner to corner . But noproblem it is a good tryall but we may take the risck sometimes

GsMen · 05-01-2004, 12:35

I also tried this solution a while ago, and some problems like raheeb and Medz point are true.

Also the powder-dust is in my workshop in every corner, not to mention the health, maybee these IC's are in a "cancer" chemicals (or perhaps the glue?)

For the "cornering" problem I was thinking to buy a support tool that hold the dremel firmly in place (with depth control) In a solderjig, it sould be possible to do the job more accurate

vule · 05-03-2004, 07:50

@gsmen

That's the way... CNC drill is not so expensive, works much faster and there is no chance to damage board ( unless it's not firmly tighten in seat )... Plus, it has vacuum to suck in all dust...

You can build one easily... Few stepping motors, pc interface and application to control coordinates... Or even you can buy LEGO kit and adapt it to hold modeling drill

BR

Vule

04-29-2004, 00:48	#1 (permalink)
Bodzio Insane Poster Join Date: Dec 2000 Location: Pila, Poland Posts: 68 Member: 2710 Status: Offline Sonork: 113620 Thanks Meter: 0	Glued UEM working solution - continuation I have changed meny gluted Ic not only UEM`s. My solution is surface grinder or litle 9V power supply boring mashine with grinderstone. Just grind off your Ic: layer after layer till you will see balls from the PCB, when you have grinded your Ic realy flat then you can try to solder your Ic on this grinded balls but that is no 100% solution. Better is if you remove all glue, with hot air station. Set temperature near 180 C degrees and slowly remove glue between bals, dont increase temp becuse you can damage tracks ond pcb. 180 C degrees is perfect temp because dont dissolve fast tins balls and you can remove almost all glue, main essential thing is to remove the biggest glue pieces. After that you can remove rest of glue and tins using Plato-Wick but very queasily. After that you can solder new Ic, with this metod I have repaired more than 20 pcs of phones, 6310 in most cases. Till I have founded solution i have dstroyed 6 pcs of 6310 and one 6100 all with glued UEM`s. First time it takes long, but if you learn this solutin it goes very easy and fast. Now i need maximum 15-20 to change gluted IC. On the beginnng i tried to pick up gluted Ic in many ways but always PCB was damage, one or two tracks were broken. Plese post your results, Im curios that my solution is working. Here are promised photos taken yesterday: Photo 1 Photo 2 Photo 3 Photo 4 Photo 5 BeSt ReGreeDs BoDziO [email protected]

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04-29-2004, 07:11	#2 (permalink)
ada0611 No Life Poster Join Date: Feb 2002 Age: 39 Posts: 710 Member: 21572 Status: Offline Thanks Meter: 1	Links not working...

04-29-2004, 07:58	#3 (permalink)
Bodzio Insane Poster Join Date: Dec 2000 Location: Pila, Poland Posts: 68 Member: 2710 Status: Offline Sonork: 113620 Thanks Meter: 0	If link is not working try: my yahoo group BeSt ReGreeDs BoDziO [email protected]

04-29-2004, 09:42	#4 (permalink)
thecult No Life Poster Join Date: Feb 2002 Location: burning phones Posts: 1,704 Member: 9700 Status: Offline Thanks Meter: 62	@Bodzio: Interesting... but you never destroy pads with the grinder? I use other method, but not safe... with wnife and hot air... insert knife behind glue and ic... and pull up. (15% times broke pad) and after, remove glue with knife and 180º (like u) b.r.

04-29-2004, 12:50	#5 (permalink)
blue1 Freak Poster Join Date: Mar 2004 Location: mediteranean Age: 45 Posts: 171 Member: 60613 Status: Offline Thanks Meter: 0	very nice discription(details)

04-30-2004, 09:38	#7 (permalink)
renejeic Freak Poster Join Date: Feb 2004 Location: Paradise On Earth Posts: 109 Member: 53684 Status: Offline Thanks Meter: 11	@bodzio ur links are not working men!!! how can i see ur pictures??

04-30-2004, 09:49	#8 (permalink)
thecult No Life Poster Join Date: Feb 2002 Location: burning phones Posts: 1,704 Member: 9700 Status: Offline Thanks Meter: 62	Thanks Bodzio, I will try this week. I have Dremmel... but I want first to buy the support platform for a better precision. @renejeic: go to his yahoo group, sign up as a member and you will download pics withouth problems b.r.

04-30-2004, 23:36	#10 (permalink)
Fonefingz No Life Poster Join Date: Jun 2003 Location: east london Age: 36 Posts: 645 Member: 32195 Status: Offline Thanks Meter: 5	@medz: great work! what tool are you using? details on actual drill "bit" and drill etc aswell would be appriciated. keep it up man!

05-01-2004, 02:00	#11 (permalink)
Medz No Life Poster Join Date: Sep 2003 Age: 66 Posts: 807 Member: 39601 Status: Offline Thanks Meter: 13	@Everybody ... Those photos are Bodzio's Photos from 1 to 5 at the top of the thread , they'r not mine ! . I restores them from my 'temporary internet files ' folder for the persons complaining from dead links

05-01-2004, 05:31	#12 (permalink)
Raheeeeb No Life Poster Join Date: Oct 2001 Location: -------- Age: 55 Posts: 1,009 Member: 7062 Status: Offline Thanks Meter: 126	hi. this way is not complete safe 100% cuz it migt reach the efficincy after destroy many pcb and this is my personal cooment 1- the drill is un easy to control 2- the powder from the ic while drilling is goes every where and cuz big mess 3- the components around the uem is very small and near 4- the tip of the drill you use is very expinsive and you can use one tip every 3 or 4 ic's . 5- the old fashion ay is more safe and its take time less than drilling way take . i m not attach hat wat but advise ppl with what i faced br.,

05-01-2004, 12:13	#13 (permalink)
Medz No Life Poster Join Date: Sep 2003 Age: 66 Posts: 807 Member: 39601 Status: Offline Thanks Meter: 13	Yes I add my voice to raheeeeb's , we test it allready ourselfs ( raheeeeb & myself ). That judjement doesnt come from nothing . Add one important thing , is that the diameter of the balls ( 0.3 mllm ) will not be equall in parallel connecting the IC to the PCB because of drimmelling variable depth from corner to corner . But noproblem it is a good tryall but we may take the risck sometimes

05-01-2004, 12:35	#14 (permalink)
GsMen No Life Poster Join Date: Sep 2000 Location: Netherlands Posts: 857 Member: 2100 Status: Offline Thanks Meter: 40	I also tried this solution a while ago, and some problems like raheeb and Medz point are true. Also the powder-dust is in my workshop in every corner, not to mention the health, maybee these IC's are in a "cancer" chemicals (or perhaps the glue?) For the "cornering" problem I was thinking to buy a support tool that hold the dremel firmly in place (with depth control) In a solderjig, it sould be possible to do the job more accurate

05-03-2004, 07:50	#15 (permalink)
vule No Life Poster Join Date: Apr 2002 Location: Radiometer Medical ApSBrønshøj Age: 51 Posts: 721 Member: 10854 Status: Offline Sonork: 1578988 Thanks Meter: 3	@gsmen That's the way... CNC drill is not so expensive, works much faster and there is no chance to damage board ( unless it's not firmly tighten in seat )... Plus, it has vacuum to suck in all dust... You can build one easily... Few stepping motors, pc interface and application to control coordinates... Or even you can buy LEGO kit and adapt it to hold modeling drill BR Vule