Here is the specification sheet of bga underfilling used in Nokia mobile phones!

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		GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > Nokia > Nokia Hardware & Hardware Repair
Here is the specification sheet of bga underfilling used in Nokia mobile phones!

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10-05-2005, 20:20

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alro

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Here is the specification sheet of bga underfilling used in Nokia mobile phones!

Hello Guys,

After a lot of research I found wich type of underfilling is used by glued BGA's in Nokia mobile phone. See their technical sheets attached.

Loctite 3566 is removea ble, melting point is 190 degrees celsius. At this temperature te TG value's changed.

Loctite 3567 is not remove able

Note, officially seen Nokia service centers are not allowed to remove glued BGA's and they have to swap the board so removing glued BGA's is a riskfull operation!

Good luck.

Attached Files

	3566-EN.pdf (15.8 KB, 74 views)
	3567-EN.pdf (18.3 KB, 35 views)

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