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Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section. |
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02-02-2004, 08:48 | #1 (permalink) |
No Life Poster Join Date: Aug 2002 Location: india Age: 63
Posts: 1,476
Member: 14578 Status: Offline Thanks Meter: 831 | Make yourself BGA tin balls. Try this and post result here. 1- Cut solder wire length 1 m.m. peaces [i use solder wire Alloy 63/37,dia. 0.4 m.m. flux-390, core 5B] 2- Put solder wire peaces are on a small glass wool [6" x 6" in a matel tray] peaces aren't contact with each other. 3- **** hote air on it. set temperature that can melt solder wire. not too much. [more temprature can melt your glass wool and it stick with ball. now your solder wire turn in to bga ball. 4- Now mess balls by bga pad, or your own way. what size of balls you want. [ you can change solder wire length as your requirment ] sorry for my english W.B.R. |
02-15-2004, 11:07 | #4 (permalink) |
Freak Poster Join Date: Jan 2002 Location: Vojvodina
Posts: 219
Member: 8704 Status: Offline Thanks Meter: 0 | Or anybody should have his own metod. You can rehot bga then push down the chip(on board) with care, get out the chip,if previously not seriously broken ball,you will have all balls on chip clean the board around bga and then solder back bga |
12-17-2012, 19:01 | #7 (permalink) |
No Life Poster Join Date: Feb 2012 Location: kanpur
Posts: 1,429
Member: 1722956 Status: Offline Sonork: mybestfriend.adeel Thanks Meter: 305 | dont waste time,buy several kind of staincils from the market and a P P D paste,a surgical blade .and make every ic small or big as you wish, |
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