solution require for broken BGA pads
 

Hi all

I face frequent problem after removing BGA IC. When I clean the pads with iron and desolder-wick, some pads peel-off from its place.

Can anybody tell me how to fix this problem ?

Thanks in advance.

Regards.

1. Don't use desolder wick....Just clean pads with soldering iron tip, it is good enough
2. Do not exceed 250 degrees celsius

br

vule

With soldering iron tip?

@ Mr.Vule

Thanks for reply. OK I accept it but in case if pads are peeled off then how to fix the problem ? I tried to take a thin wire and soldered it to IC and then soldered the IC to its place but all the time the thin wire tends to displace when get heated. What care shoul I take ?

If anyone have solution please guide me. Thanks.

Regards...

the best way to fixe that type of problem demand a lot practice
-have a good quality of solder paste
-have a good knife to clin the broken tract
-clean your tract softly until you see the wire in the small hole
-put a little bit of paste and heat it up whit your hot-air until you have ball
-press it down with a twiser or a pice of metal until you it get the shap other track

the solder wick is very helpfull.but some people should know how to use it.
1-the difficult problem is what type of soldering machine that we use
2-have you got a good one with a nice clean tip
3-your temperature is good enough to clean the board