solution require for broken BGA pads - GSM-Forum

rajumobile · 12-13-2004, 01:58

Hi all

I face frequent problem after removing BGA IC. When I clean the pads with iron and desolder-wick, some pads peel-off from its place.

Can anybody tell me how to fix this problem ?

Thanks in advance.

Regards.

vule · 12-13-2004, 08:43

1. Don't use desolder wick....Just clean pads with soldering iron tip, it is good enough
2. Do not exceed 250 degrees celsius

br

vule

Bypx · 12-13-2004, 09:13

With soldering iron tip?

rajumobile · 12-14-2004, 19:56

@ Mr.Vule

Thanks for reply. OK I accept it but in case if pads are peeled off then how to fix the problem ? I tried to take a thin wire and soldered it to IC and then soldered the IC to its place but all the time the thin wire tends to displace when get heated. What care shoul I take ?

If anyone have solution please guide me. Thanks.

Regards...

bakoume · 10-14-2005, 15:34

Quote:

Originally Posted by rajumobile

@ Mr.Vule
Thanks for reply. OK I accept it but in case if pads are peeled off then how to fix the problem ? I tried to take a thin wire and soldered it to IC and then soldered the IC to its place but all the time the thin wire tends to displace when get heated. What care shoul I take ?
If anyone have solution please guide me. Thanks.
Regards...

the best way to fixe that type of problem demand a lot practice
-have a good quality of solder paste
-have a good knife to clin the broken tract
-clean your tract softly until you see the wire in the small hole
-put a little bit of paste and heat it up whit your hot-air until you have ball
-press it down with a twiser or a pice of metal until you it get the shap other track

bakoume · 10-14-2005, 15:45

Quote:

Originally Posted by vule

1. Don't use desolder wick....Just clean pads with soldering iron tip, it is good enough
2. Do not exceed 250 degrees celsius
br
vule

the solder wick is very helpfull.but some people should know how to use it.
1-the difficult problem is what type of soldering machine that we use
2-have you got a good one with a nice clean tip
3-your temperature is good enough to clean the board

12-13-2004, 01:58	#1 (permalink)
rajumobile No Life Poster Join Date: Feb 2004 Age: 52 Posts: 593 Member: 54993 Status: Offline Thanks Meter: 47	solution require for broken BGA pads Hi all I face frequent problem after removing BGA IC. When I clean the pads with iron and desolder-wick, some pads peel-off from its place. Can anybody tell me how to fix this problem ? Thanks in advance. Regards.

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12-13-2004, 08:43	#2 (permalink)
vule No Life Poster Join Date: Apr 2002 Location: Radiometer Medical ApSBrønshøj Age: 51 Posts: 721 Member: 10854 Status: Offline Sonork: 1578988 Thanks Meter: 3	1. Don't use desolder wick....Just clean pads with soldering iron tip, it is good enough 2. Do not exceed 250 degrees celsius br vule

12-13-2004, 09:13	#3 (permalink)
Bypx No Life Poster Join Date: Apr 2004 Location: Milano, Italy Age: 37 Posts: 2,170 Member: 62336 Status: Offline Thanks Meter: 115	With soldering iron tip?

12-14-2004, 19:56	#4 (permalink)
rajumobile No Life Poster Join Date: Feb 2004 Age: 52 Posts: 593 Member: 54993 Status: Offline Thanks Meter: 47	@ Mr.Vule Thanks for reply. OK I accept it but in case if pads are peeled off then how to fix the problem ? I tried to take a thin wire and soldered it to IC and then soldered the IC to its place but all the time the thin wire tends to displace when get heated. What care shoul I take ? If anyone have solution please guide me. Thanks. Regards...