Some information for bb5 chips

[gopalhot]

RAP3G

RAP3G is a 3G Radio Application Processor
Successor for TIKU (used in NOKIA 7600) with some technical improvements and additional features
In general RAP3G consists of three separate parts:
Processor subsystem (PSS) that includes ARM926 MCU as a main processor, Lead3 PH3 DSP and related functions
MCU peripherals
DSP peripherals
RAP3G is running with NOS and takes care of all cellular modem activities
RAP3G core voltage (1.40V) is generated from TAHVO VCORE and I/O voltage (1.8V) is from RETU VIO. Core voltage in sleep mode is lowered to 1.05V

RETU

RETU is the primary EM ASIC including following functional blocks:
Start up logic and reset control
Charger detection
Battery voltage monitoring
32.768kHz clock with external crystal
Real time clock with external backup battery
SIM card interface
Stereo audio codecs and amplifiers
A/D converter
Regulators
Vibra interface
Digital interface (CBUS)
RETU ASIC does not include security functions such as UEM(E,K)

TAHVO

TAHVO is the secondary EM ASIC including following functional blocks:
Core supply generation (VCORE & VCOREA)
Charge control circuitry
Level shifter and regulator for USB/FBUS
Current gauge for battery current measuring
External LED driver control interface
Digital interface (CBUS)
TAHVO ASIC does not include security functions such as UEM(E,K)

CMT Flash
CMT Flash memory is used to store:
MCU program code
DSP program code
Tuning values
Certificates
Capacity: 64Mbit
Logic and supply voltage for NOR Flash is supplied from VIO (1.8V)
Flash clock is 48MHz (192MHz/4)

CMT SDRAM

CMT SDRAM is mainly used as a dynamic data storage for MCU data
Capacity: 64MBit
SDRAM core voltage (1.8V) is generated by RETU’s VDRAM regulator
I/O voltage (1.8V) is generated by RETU’s VIO regulator
SDRAM clock is 96MHz (192MHz/2)

OMAP 1710

OMAP is the application processor running with Symbian operating system (EPOC)
Platform for executing all user related application. Main interfaces:
Camera interface
Display interface
Bluetooth interface
MMC interface
USB interface
Keyboard interface
X-Bus for communication with RAP3G
OMAP is a standard ASIC designed by Texas Instruments and used also by other manufacturers of mobile phones and handheld PCs
Core voltage VCORE=1.4V is generated by discrete SMPS, and is lowered to 1.09V in sleep mode
I/O voltage VIO=1.8V is generated by RETU

APE Combo Memory
APE Flash is used to store application code and user data
It is not possible to execute code directly from Flash -> executables need first to be loaded to DDR and run from there
Capacity: 256Mbit (Flash), 256Mbit (DDR)
Core voltage for DDR is VDRAM 1.8V
VIO 1.8V is for DDR I/O voltage
Both NAND core and I/O voltages are generated by RETU
DDR clock is 110MHz (220MHz/2)
Flash interface speed is 22MHz


Product Specific Circuitries

Front Camera
The front camera is controlled and its data is collected by OMAP
The I/O voltage of OMAP is 1.8V, and the one of the camera is 2.8V; therefore a level shifter is needed
The camera is powered with two different voltages from LDO (Low-dropout voltage) regulators:
VCAM 1.5V for camera digital circuits, and sensor A/D-converter
VCAM2 2.8V for camera I/O, and sensor photo diode

[gopalhot]

Bluetooth™

Single chip BT BC3 (includes RF, BB & ROM memory)
UART interface for control/data with OMAP
PCM interface for audio data with RAP3G
IO voltage 1.8V from VIO
****og voltage 2.85V from VBAT through discrete LDO
Clock 38.4MHz from RF part

[gopalhot]

Ambient Light Sensor

Ambient Light Sensor is located in the upper part of the phone and consists of:
Light guide (part of front cover)
phototransistor + resistor
NTC + resistors
RETU
Information of ambient lighting is used to control backlights of the phone:
Keypad lighting is only switched on when environment is dark/dim
Display backlights are dimmed, when environment is dark/dim
Attached Thumbnails

[gopalhot]

Ambient Light Sensor

Ambient Light Sensor is located in the upper part of the phone and consists of:
Light guide (part of front cover)
phototransistor + resistor
NTC + resistors
RETU
Information of ambient lighting is used to control backlights of the phone:
Keypad lighting is only switched on when environment is dark/dim
Display backlights are dimmed, when environment is dark/dim
Attached Thumbnails
http://www.mygsmindia.com/vbb/attach...8&d=1206773098

[nilesh_patel717]

thnks for information

[gopalhot]

Power Control Loop
Power Control Loop – WCDMA Transmitter 1/2

TXC is used to drive the VGA which is used as the “main power controller”
The PA outside is just for the final setting of the outgoing power
WCDMA uses closed loop SW power control, where the Base Station will provide information for the terminal to increase or decrease its power by 1 or 2 dB steps

Power Detection: It is required that terminal must be able to measure its output power in high power level. The power detector measure it and fed a voltage (WTXDET) back to RETU to undergo AD conversion
Output power needs to be limited to +21 dBm

Isolator: It passes RF power only in one direction. Without it, RF power may leak in and affect the output of the detection circuit, resulting in error in the power control

Power Control Loop – WCDMA Transmitter 2/2

SMPS: The supply voltage of the PA and limits the lowest supply voltage to 1.5V. At highest power levels the SMPS output settles nominally to 3.2V
The supply voltage and the reference current lines (DAC 101 and DAC 201) are used to set the PA to distortion-free gain according to PA vendor's specification; this is essential in WCDMA

Synthesizers

[gopalhot]

Key Components 0f WCDMA Receiver
Why do we need Additional Filtering?
This SAW filter is to attenuate the Tx signal which is leaking through the duplex filter and amplified by the LNA
Why do we use duplexer instead of antenna switch?
This is because Tx and Rx are functioning in continuous mode in WCDMA
What is the use of AGC stage?
This stage is used to maintain the voltage swing at the AD converter in BB at an adequate level

Power Control Loop – GSM Transmitter

Power Detector Circuitry in PA gives a DC value proportional to the output power
DC level is feedback to the negative input of ERROR amplifier in VINKU
The DC level is then compare with the TXC reference signal
The output of the ERROR amplifier is then fed to a buffer amplifier which drive the VGA

Note: TXC is obtained from the
network for power level control

[gopalhot]

Post Interfaces to BB
Interfaces to BB


Supply voltages
VBATT from battery
VXO, VCP1, VCP2, VREF from RETU
Control signals
AFC, TXC from RETU
RFBUS from RAP3G
Data signals
RXI/Q to RAP3G
TXI/Q from RAP3G
Outgoing signals
Clock (balanced) to RAP3G
Clock (single ended) to Bluetooth™
VREF for RXI/Q ADCs
IREF for TXI/Q DACs
RFTEMP, WTXDET to RETU

WCDMA Power Amplifier

[gopalhot]

INFORMATION FOR NOKIA EMIF IC
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EMIF04-10006F2.zip-mmc ic
EMIF04-MMC02F1.zip-mmc ic
EMIF04-MMC02F2...zip-mmc ic
EMIF04-MMC02F3.zip-mmc ic
EMIF04-VIDO1F2.zip-mmc ic


-------------------------------------------------------------------------
EMIF03-SIM01F2.zip-nokia sim ic
EMIF03-SIM01.zip -nokia sim ic
EMIF03-SIM02F2.zip-nokia sim ic
---------------------------------------------------------------------
EMIF02-MIC03F2.zip
EMIF02-SPK01F2.zip
EMIF02-USB02F2.zip
EMIF02-USB05C2.zip

--------------------------------------------------------------------
EMIF01-SMIC01F2.zip-BB5 mic ic
EMIF01-TV03F1.zip
EMIF02-MIC02F1.zip
EMIF02-MIC02F2.zip

-------------------------------------------------------------------
EMIF10-COM01F2.zip -key and lcd ic
EMIF10-LCD01F2.zip -key and lcd ic
EMIF10-LCD01F2.zip -key and lcd ic
EMIF-10-1K010F1.zip -key and lcd ic
EMIF-10-1K010F2.zip -key and lcd ic

-------------------------------------------------------------------
BFG10X_4.zip -NPN 2 GHz RF power transistor
bgf100.rar- heandset mic ic

------------------------------------------------------------
LP2985.zip-regulator
LP3928.zip-regulator
LP3985.zip-regulator
LP3987.zip-regulator
LP3999.zip-APE regulator N2401-of N70

---------------------------------------------------
ESDA14V2-4BF2.rar-heandset ear ic
ESDA 18-1F2.rar-charge in zener diode
---------------------------------------------------------------
LED driver

TK11850.zip
TK11851.zip
TK11855.zip
TK65600.zip-N2301 LED driver N70

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TAHVO v4.1

6630,6680,6681,E50?,E60N70,N71,N90

TAHVO v5.2 LF

3110classic,3250,5200,5300,5500,6125,6126
6131,6133,6136,6151,6233,6234,6270,6280
6300,7370,7373,E62,E70,N72,N91,

[gopalhot]

A normal battery has only two terminals brought out of its casing. But the batteries used in Mobile Phones, many times have more than 2, at least 3 or even 4 (at the most) terminals brought out on its casing. You may wonder why so? It is very interesting to go into the details and know more about it. Though the charging circuit inside a mobile phone is generally designed with providing a very very safe charging voltage to the battery, it is made more perfect with the use of this additional terminals provided on the battery casing.

Let us see why it is thought necessary, to provide more than the normal 2 terminals in Mobile Phones Batteries. Take the case of a Nokia phone 3310 or 3315. You may notice that for this particular model of the phone the batteries available are of both the types, Ni-Mh as well as Li Ion types. It is necessary to inform you at this stage that not only the charging current may differ in these two different kinds of batteries but also the voltage level up to which they can be charged safely will also differ in them. To be more specific, the Ni-Mh battery can be charged safely up to 5.2 volts whereas the Li Ion battery’s safe voltage is only 4.8 volts. So the same circuit in the mobile phone will have to stop charging the batteries at different levels of voltages in each case. So how it will know which kind of battery is inserted in the mobile phone and to be charged and so at which level to stop charging in each of the case? This is achieved with the help of a standard, pre-decided or pre-determined by all the battery manufacturers according to which they put extra components inside each battery casing which will bring a certain predetermined voltage level at that point called BSI (Battery Size Indicator), which will help not only to know the type of battery it is but will also let us know it’s capacity in mAH!!!! Isn’t it very intelligent?
Yes, it is a very nice way of letting the charging circuit to know how much charging current it should supply and on reaching which level of voltage, it should stop supplying the charging current to the battery. I am sure, all of you would like to now how this is achieved. The following details taken from the technical pages for the Nokia Model 3310 will help you understand this better.
The type of the battery inserted in the mobile phone is found out by the think-tank of the phone, which is the CPU (Central processing Unit) of the mobile phone. In the case of Nokia 3310-3315 models it is the IC known as MAD IC, which is actually the CPU of the mobile phone. This is done by the CPU with the help of the Charging Control IC of the phone CCONT IC. The CCONT IC reads the voltage at a point on the battery called the BSI line. The Batteries contain a pull-down (connected to either ground or the –ve terminal of the battery) resistor inside the battery casing. Typically, for a BLB-2 type of Nokia battery (Li Ion 650 mAH), it is a 68Kohms resistor. Other values used in other types of batteries are listed in the table below:

Battery Type and it’s capacity Value of the pull down resistor inside the battery
BMC-2 Ni-Mh 640mAH 3.3K (3.3K=3.3Kohms=3300ohms)
BMC-3 Ni-Mh 900mAH 5.6K
BLB- 2 Li-Ion 650 mAH 68K
BLC- 2 Li-Ion 900 mAH 75K

How would this help identifying the type of battery?
Let us try to visualize the schematic of the Battery related components. This BSI point of the Battery is connected as shown below in the figure via a 10K resistor to a point on the CCONT IC. Also it is connected to 2.8volts supply line via a pull-up resistor of a value fixed at 150K.







The thermistor RT is a thermal kind of resistor, whose value decreases as it’s temperature rises. As above in the case of BSI point, the BTEMP point of the Battery is connected with a pull-up (to pull up the voltage) resistor of 100K.

When the Battery is put for charging in the mobile phone, there is normally a little rise in the temperature of the battery. This will cause a rise in temperature of the Resistance RT inside the battery casing. Now as per the characteristic of the NTC resistor , it’s resistance value decreases as it’s temperature rises. This also changes the voltage at the BTEMP point of the battery as well as the CCONT BTEMP pin. This change is always fed to the CPU which keeps monitoring it continuously. This is always online referred to the Energy Managemant Software loaded in the Memory ICs (Flash & RAM ICs) inside the phone. When the temperature inside the battery increases beyond it’s allowed limit, this change in voltage at the BTEMP point will be processed in the CPU and the Memory ICs and the CPU will then ask the CCONT IC to stop supplying the charging current to the battery and will stop charging absolutely to save the battery from any damage that may occur due to it’s rise in temperature.

Thus, in Nokia 3310-3315-3330-3390 etc. series of Phones, all the functions of charging are achieved very accurately and perfectly with the use of :
(1) Chaps (Charging IC)
(2) CCONT (Charging Controller IC)
(3) MAD (CPU IC)
(4) Memory ICs (Flash & RAM ICs) &
(5) Energy Management Software loaded in the Flash IC.

[tahseen]

thanx my brother , really good work

[ranji]

goood ork brother keep it up

[realtech]

Excellent Information

[sekar98425]

Very useful post .Thanks Bro

[k_abhi]

Thanx for the imp info brother.......... I've a question.......... Can we check resistors & capacitor using a multimeter???????? how could we do that?????