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Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section. |
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09-25-2003, 18:09 | #1 (permalink) |
Registered User Join Date: Sep 2003 Location: Palestine Age: 50
Posts: 1,951
Member: 39208 Status: Offline Thanks Meter: 152 | What's Wrong ...? This problem is making me crazy ...., After reballing ccont or any BGA ic ...., after 2 or 3 days or may be 2 hours the balls is disconnedted from the BGA ic it self and the problems is comming ...., What is the wrong thing do i do ...? i'm using a normal flux ( does the bga need a special flux ...?) and a chiness solder paste ..., and i heat them ( at what temp shall i use for reballing ) I'm sure there is something wrong but i can not determine what is it ...., Any one can help ...? pls expain ... |
09-26-2003, 00:58 | #2 (permalink) |
No Life Poster Join Date: Sep 2003 Age: 66
Posts: 807
Member: 39601 Status: Offline Thanks Meter: 13 | OK I'm going to tell somthing i use and it is verey usefull to me I'm useing a radioshack flux, It's vescosity is sutablle , be sure that the flux flues under the IC (when reflowing) or place the IC 1st then use the flux. After I put a small weight ( I'm useing a computer's case screw ) , then applly heat untill all the solder becomes liquid ( u can see the screw moves with the IC). waite untill coolsdown then remove the weight. Et voila |
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