T28, how to dismantle? - GSM-Forum

ALieN_CHeMiST · 05-08-2000, 11:15

Anyone know how to dismantle this phone to read EEPROM?

All help greatly appreciated.

Jim

Miko · 05-08-2000, 19:54

BE CAREFULL WHEN OPENING PHONE, YOU CAN DESTROY IT!

FIRST, TAKE OFF THE ANTENNA. THE PHONE IS PACKED LIKE SIEMENS C25. IF YOU OPEN IT WRONG ... SORRY

omelette · 05-18-2000, 14:10

Hi. Opening these is trickier for a number of reasons.
Firstly, Ericsson issue three blade type tools to open the phone, all about 50-60mm wide. After removing the antenna, insert one into each side at an angle and one at the antenna end. Then simultaneously push on all three. This will split the case halves. The next problem is removing the PCB. Ericsson has glued three BGA components to the case and advise using freezer spray around the label area to induce therminal shrinkage to crack the adhesive bond before trying to remove the PCB. If you don't do this there is a real danger that the BGAs will be ripped off the PCB. When putting it back together these are supposed to be re-glued.
Hope this helps.

05-08-2000, 11:15	#1 (permalink)
ALieN_CHeMiST Freak Poster Join Date: Feb 2000 Location: Bristol - UK Posts: 286 Member: 1034 Status: Offline Thanks Meter: 0	T28, how to dismantle? Anyone know how to dismantle this phone to read EEPROM? All help greatly appreciated. Jim

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05-08-2000, 19:54	#2 (permalink)
Miko Freak Poster Join Date: Nov 1999 Posts: 188 Member: 707 Status: Offline Thanks Meter: 0	BE CAREFULL WHEN OPENING PHONE, YOU CAN DESTROY IT! FIRST, TAKE OFF THE ANTENNA. THE PHONE IS PACKED LIKE SIEMENS C25. IF YOU OPEN IT WRONG ... SORRY

05-18-2000, 14:10	#3 (permalink)
omelette Junior Member Join Date: Feb 2000 Location: London, England Posts: 25 Member: 940 Status: Offline Thanks Meter: 0	Hi. Opening these is trickier for a number of reasons. Firstly, Ericsson issue three blade type tools to open the phone, all about 50-60mm wide. After removing the antenna, insert one into each side at an angle and one at the antenna end. Then simultaneously push on all three. This will split the case halves. The next problem is removing the PCB. Ericsson has glued three BGA components to the case and advise using freezer spray around the label area to induce therminal shrinkage to crack the adhesive bond before trying to remove the PCB. If you don't do this there is a real danger that the BGAs will be ripped off the PCB. When putting it back together these are supposed to be re-glued. Hope this helps.