Bga reballing problem
 

I m having **** problem while reballing chips. Problem is when ever i reball ic it gets stuck in stencile plate. N if i try to remove it then all balls gets destroy. I m really annoyed with this problem . I m using reballing paste for reballing. Anyone can suggest me what should i do?


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Hi

1- clean well the stencil with isopropilic / propanol (important ! )
2- put the solder past on stencil On a flat surface
3- Bring in the temperature with your hot air and before removing the ICs over a bit of good flux (imortant! )
4-for removing reballed ic use hot air a max speed .

use good reballing paste ...i use Kester paste very good but expensive.

Hold the balls directly on the pitches of the ic

You mean premade balls?


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intends balls already ready to be positioned on Ic .. but this you can try on " big" ic as nand, on small ic for me a waste of time ..for mobile is convenient to use stencil Or you can use if you're very skills at pyramid technique with solder iron ..ceck you tube for this.

balls already ready is used for reballing m.board laptop / notebook

Any trustable reseller?

online search Digikey .

is there any good video link of these ?


what is that above mentioned pyramid technique ?
any video ?

orx already replied , check youtube , there are so many videos about reballing bga ic's .

i have tried finding this pyramid technique with solder iron ,
but didnt get any ,

what is pyramid technique with solder iron ?

use the stencils and you are much faster these virtuosity for reballing with pyramid technique only serve if you have an ic with a particular design and you do not find the suitable stencil.
I bet that in a speed competition between those who use the stencils and who reball by hand I win ;)
anyway it takes patience and practice for both.