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Go Back   GSM-Forum > GSM & CDMA Phones Hardware Repair Area > Hardware Equipments for GSM

Hardware Equipments for GSM All about Hardware Instruments and equipments like Soldering Stations, Hardware Tools, Oscilloscopes , Frequency Counters ..ext.

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Old 05-06-2017, 21:22   #1 (permalink)
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Bga reballing problem


I m having **** problem while reballing chips. Problem is when ever i reball ic it gets stuck in stencile plate. N if i try to remove it then all balls gets destroy. I m really annoyed with this problem . I m using reballing paste for reballing. Anyone can suggest me what should i do?


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Old 05-07-2017, 08:37   #2 (permalink)
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Hi

1- clean well the stencil with isopropilic / propanol (important ! )
2- put the solder past on stencil On a flat surface
3- Bring in the temperature with your hot air and before removing the ICs over a bit of good flux (imortant! )
4-for removing reballed ic use hot air a max speed .

use good reballing paste ...i use Kester paste very good but expensive.

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Old 05-08-2017, 20:14   #3 (permalink)
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Hold the balls directly on the pitches of the ic
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Old 05-08-2017, 23:11   #4 (permalink)
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Quote:
Originally Posted by fulviospano View Post
Hold the balls directly on the pitches of the ic


You mean premade balls?


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Old 05-10-2017, 16:20   #5 (permalink)
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intends balls already ready to be positioned on Ic .. but this you can try on " big" ic as nand, on small ic for me a waste of time ..for mobile is convenient to use stencil Or you can use if you're very skills at pyramid technique with solder iron ..ceck you tube for this.

balls already ready is used for reballing m.board laptop / notebook
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Old 05-10-2017, 19:11   #6 (permalink)
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Quote:
Originally Posted by orx View Post
Hi
i use Kester paste very good but expensive.
Any trustable reseller?
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Old 05-10-2017, 19:24   #7 (permalink)
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online search Digikey .
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Old 12-19-2017, 18:43   #8 (permalink)
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Quote:
Originally Posted by orx View Post
Hi

1- clean well the stencil with isopropilic / propanol (important ! )
2- put the solder past on stencil On a flat surface
3- Bring in the temperature with your hot air and before removing the ICs over a bit of good flux (imortant! )
4-for removing reballed ic use hot air a max speed .

use good reballing paste ...i use Kester paste very good but expensive.
is there any good video link of these ?


Quote:
Originally Posted by orx View Post
intends balls already ready to be positioned on Ic .. but this you can try on " big" ic as nand, on small ic for me a waste of time ..for mobile is convenient to use stencil Or you can use if you're very skills at pyramid technique with solder iron ..ceck you tube for this.

balls already ready is used for reballing m.board laptop / notebook
what is that above mentioned pyramid technique ?
any video ?
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Old 12-25-2017, 18:54   #9 (permalink)
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orx already replied , check youtube , there are so many videos about reballing bga ic's .
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Old 12-27-2017, 06:46   #10 (permalink)
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i have tried finding this pyramid technique with solder iron ,
but didnt get any ,

what is pyramid technique with solder iron ?
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Old 12-29-2017, 08:10   #11 (permalink)
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use the stencils and you are much faster these virtuosity for reballing with pyramid technique only serve if you have an ic with a particular design and you do not find the suitable stencil.
I bet that in a speed competition between those who use the stencils and who reball by hand I win
anyway it takes patience and practice for both.
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