Recommend solder supply/accessories for iPhone NAND and BGA repairs - GSM-Forum

Stunman112 · 02-24-2017, 00:06

I have a rework station coming in the mail and I'm ready to get started with the Apple idevice BGA hardware work. I will be using hot air and a heating bed for repairs on this new rework station. I have NAND and eeprom programmers also. So I'm ready to start when the station arrives.

I need some suggestions on solder type to use for reballing. Or use the solder balls? I have iphone chip stencils too. Also, what type of Flux I should use? And I have heard kapton tape doesn't reflect heat that well when working with the hot air gun. So any suggestions on these items? I would like to know if there is anything I have missed.

Thank you

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fulviospano · 02-24-2017, 22:41

You can put some pictures of the rework station?

Stunman112 · 02-24-2017, 22:41

Tomorrow

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Stunman112 · 02-25-2017, 23:02

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fulviospano · 02-26-2017, 00:14

The pre-heater has to work to 100-130 ° C, the component you wish, Wick should be monitored with a dedicated probe in order to check that the temperature does not exceed 260 ° C, if the component is resin must remove this and help with a scalpel for the separation of the component, make a lot of evidence of dead plates, used as flux AMTECH original 995. If you want my advice limited to working on the nand because the cpu need professional equipment to be machined.

Stunman112 · 02-26-2017, 00:19

The unit spec for pre heat bed is 0-300°c I have on order a laser probe. I also have a scalpel set coming too. And I will check your AMTECH Flux out.. as far as nand and cpu I am generally going to be starting out with iPad so not to rush into CPU'S. I know the grinder machine is really expensive!

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fulviospano · 02-26-2017, 00:29

should not raise too much the temperature of the preheater or else run the risk of them coming off of SMD components, if you want to use the milling method without spending a fortune, you can use one the Proxxon MF70.

Stunman112 · 02-26-2017, 00:33

I don't know much about those machines but I get what they are for. The ones I have seen in videos have a file loaded from the computer and it gives the exact locations to chip at. Do all the machines do this or are some of them manual?

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fulviospano · 02-26-2017, 00:37

However it is not convenient to work on components such as CPU, where the biggest problem is not only to detach the component but the centering of pitches in welding, to do it well it takes a car to reballing with automatic centering, too expensive.

Stunman112 · 02-26-2017, 00:37

What did you mean exactly when you said dead plates when using the scalpel? The protective films underneath the nands can be damaged easily. You are saying Appling Flux will help this?

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fulviospano · 02-26-2017, 00:47

I mean that you have to try on motherboards of dead phones for practice, the flux helps but if there is the resin around the component you have to take, obviously you can only take that around the part and not the one under which must be removed by introducing a scalpels or blades made on purpose to this work.

fulviospano · 02-26-2017, 00:56

Remove the motherboard chip tool burin Remove A9 CPU A8 Ultra thin blade 0.05mm graver Mobile phone repair tool for iphone

Stunman112 · 02-26-2017, 03:04

Would you recommend solder balls and all their different sizes or solder paste for reballing?

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fulviospano · 02-26-2017, 13:19

the balls are fine for BGA of laptop computers, the components of the smartphone I suggest the MECHANIC XG-50 Solder Paste Flux Paste tin cream Sn63 / Pb37 25-45um 42g

fulviospano · 02-26-2017, 13:21

to apply it uses IC Chip BGA Reballing Stencil Kits September Solder template for iphone 4 4s 5 5s 5C 6 7 6s Plus ES iPad high

02-24-2017, 00:06	#1 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	Recommend solder supply/accessories for iPhone NAND and BGA repairs I have a rework station coming in the mail and I'm ready to get started with the Apple idevice BGA hardware work. I will be using hot air and a heating bed for repairs on this new rework station. I have NAND and eeprom programmers also. So I'm ready to start when the station arrives. I need some suggestions on solder type to use for reballing. Or use the solder balls? I have iphone chip stencils too. Also, what type of Flux I should use? And I have heard kapton tape doesn't reflect heat that well when working with the hot air gun. So any suggestions on these items? I would like to know if there is anything I have missed. Thank you Sent from my SCH-I545 using Tapatalk

02-24-2017, 22:41	#2 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	You can put some pictures of the rework station?

02-24-2017, 22:41	#3 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	Tomorrow Sent from my SCH-I545 using Tapatalk

02-25-2017, 23:02	#4 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	Sent from my SCH-I545 using Tapatalk

02-26-2017, 00:14	#5 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	The pre-heater has to work to 100-130 ° C, the component you wish, Wick should be monitored with a dedicated probe in order to check that the temperature does not exceed 260 ° C, if the component is resin must remove this and help with a scalpel for the separation of the component, make a lot of evidence of dead plates, used as flux AMTECH original 995. If you want my advice limited to working on the nand because the cpu need professional equipment to be machined.

02-26-2017, 00:19	#6 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	The unit spec for pre heat bed is 0-300°c I have on order a laser probe. I also have a scalpel set coming too. And I will check your AMTECH Flux out.. as far as nand and cpu I am generally going to be starting out with iPad so not to rush into CPU'S. I know the grinder machine is really expensive! Sent from my SCH-I545 using Tapatalk

02-26-2017, 00:29	#7 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	should not raise too much the temperature of the preheater or else run the risk of them coming off of SMD components, if you want to use the milling method without spending a fortune, you can use one the Proxxon MF70.

02-26-2017, 00:33	#8 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	I don't know much about those machines but I get what they are for. The ones I have seen in videos have a file loaded from the computer and it gives the exact locations to chip at. Do all the machines do this or are some of them manual? Sent from my SCH-I545 using Tapatalk

02-26-2017, 00:37	#9 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	However it is not convenient to work on components such as CPU, where the biggest problem is not only to detach the component but the centering of pitches in welding, to do it well it takes a car to reballing with automatic centering, too expensive.

02-26-2017, 00:37	#10 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	What did you mean exactly when you said dead plates when using the scalpel? The protective films underneath the nands can be damaged easily. You are saying Appling Flux will help this? Sent from my SCH-I545 using Tapatalk

02-26-2017, 00:47	#11 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	I mean that you have to try on motherboards of dead phones for practice, the flux helps but if there is the resin around the component you have to take, obviously you can only take that around the part and not the one under which must be removed by introducing a scalpels or blades made on purpose to this work.

02-26-2017, 00:56	#12 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	Remove the motherboard chip tool burin Remove A9 CPU A8 Ultra thin blade 0.05mm graver Mobile phone repair tool for iphone

02-26-2017, 03:04	#13 (permalink)
Stunman112 No Life Poster Join Date: May 2016 Location: 574 Age: 31 Posts: 761 Member: 2567774 Status: Offline Thanks Meter: 255	Would you recommend solder balls and all their different sizes or solder paste for reballing? Sent from my SCH-I545 using Tapatalk

02-26-2017, 13:19	#14 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	the balls are fine for BGA of laptop computers, the components of the smartphone I suggest the MECHANIC XG-50 Solder Paste Flux Paste tin cream Sn63 / Pb37 25-45um 42g

02-26-2017, 13:21	#15 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	to apply it uses IC Chip BGA Reballing Stencil Kits September Solder template for iphone 4 4s 5 5s 5C 6 7 6s Plus ES iPad high