Ersa IR500 - GSM-Forum

Umbie · 08-22-2010, 17:40

I have some questions about the Ersa IR 500

I recently got this rework station, and after some practice I managed to desolder BGA chips, and proper reball it (for those who want to start reballing, you are using to much flux

)

But soldering it back onto the PCB is a bit hard, I've watched several video's but all of those video's are with station wich are using a solder profile, so that's complete automaticly.
The IR500 doesn't have this, so anybody who can help me out a bit?

Thanks in advance.

Umbie · 08-24-2010, 19:58

Nobody?
Does anybody know where I can find more info?

debeliamark · 08-25-2010, 05:30

It's easy .... just make some tries ... the right soldering is depend of soldering balls used for reballing ( or soldering paste ) - you can easy check temperature that is required , also soldering is depend of PCB surface and components around - the much shields ect will steal the heat delivered to place of reworked component... The IR500 ( i have this more that few years ) have temperature probe and you can easy check / control it over PCB ... so - preheat PCB to 60% of desired temperature, using upper heater on not more that 40 - 50% - place reballed IC where you wish, rise temperature by increase of upper heat to desired ( +10 degree from soldering balls/paste mark ) , keep it for a 10 seconds in +/- 1 °C from desired to be sure that all balls are melt and take out upper heater. Let temperature slow down on 30% without to move the PCB from soldering place. Take out then probe and slide the PCB over the cooling fan ... check results

Umbie · 08-27-2010, 15:39

Thanks.
I've managed to get a manual, but in the manual it's different from what you describe.

My problem is that the pcb is bending havelly, so much that the BGA won't be soldered the right way.

My solder has a melting point of 183 degrees, so if I get you right I have to preheat the pcb (without the BGA placed) to 110 degrees, then place the BGA and heat it to 173 degrees? for 10 seconds?

You said using the upper heater nog more then 40 - 50%, how do I do that?
Wich values sould I set the upper and lower heater to? and what's the best clearence between the lower heater and the pcb and between the pcb and the upper heater?

I have tried several pcb's but without luck.. reballing is no problem, but soldering it back....

08-22-2010, 17:40	#1 (permalink)
Umbie Junior Member Join Date: Aug 2010 Posts: 8 Member: 1375919 Status: Offline Thanks Meter: 2	Ersa IR500 I have some questions about the Ersa IR 500 I recently got this rework station, and after some practice I managed to desolder BGA chips, and proper reball it (for those who want to start reballing, you are using to much flux ) But soldering it back onto the PCB is a bit hard, I've watched several video's but all of those video's are with station wich are using a solder profile, so that's complete automaticly. The IR500 doesn't have this, so anybody who can help me out a bit? Thanks in advance.

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08-24-2010, 19:58	#2 (permalink)
Umbie Junior Member Join Date: Aug 2010 Posts: 8 Member: 1375919 Status: Offline Thanks Meter: 2	Nobody? Does anybody know where I can find more info?

08-25-2010, 05:30	#3 (permalink)
debeliamark No Life Poster Join Date: May 2001 Location: Bulgaria Age: 56 Posts: 4,796 Member: 4627 Status: Offline Sonork: 57528:debeliamark Thanks Meter: 1,034	It's easy .... just make some tries ... the right soldering is depend of soldering balls used for reballing ( or soldering paste ) - you can easy check temperature that is required , also soldering is depend of PCB surface and components around - the much shields ect will steal the heat delivered to place of reworked component... The IR500 ( i have this more that few years ) have temperature probe and you can easy check / control it over PCB ... so - preheat PCB to 60% of desired temperature, using upper heater on not more that 40 - 50% - place reballed IC where you wish, rise temperature by increase of upper heat to desired ( +10 degree from soldering balls/paste mark ) , keep it for a 10 seconds in +/- 1 °C from desired to be sure that all balls are melt and take out upper heater. Let temperature slow down on 30% without to move the PCB from soldering place. Take out then probe and slide the PCB over the cooling fan ... check results

08-27-2010, 15:39	#4 (permalink)
Umbie Junior Member Join Date: Aug 2010 Posts: 8 Member: 1375919 Status: Offline Thanks Meter: 2	Thanks. I've managed to get a manual, but in the manual it's different from what you describe. My problem is that the pcb is bending havelly, so much that the BGA won't be soldered the right way. My solder has a melting point of 183 degrees, so if I get you right I have to preheat the pcb (without the BGA placed) to 110 degrees, then place the BGA and heat it to 173 degrees? for 10 seconds? You said using the upper heater nog more then 40 - 50%, how do I do that? Wich values sould I set the upper and lower heater to? and what's the best clearence between the lower heater and the pcb and between the pcb and the upper heater? I have tried several pcb's but without luck.. reballing is no problem, but soldering it back....