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11-26-2005, 10:09
| #1 (permalink) |
| Freak Poster  Join Date: Feb 2003 Location: POLAND Age: 46
Posts: 451
Member: 20822 Status: Offline Thanks Meter: 3 | NEW!!!BGA Planting Kit for CPUin Siemens series x65, x7x it's proffesional stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. List of supported phones: A70, A75, AX75, C75, CX75, M75, Siemens CX70, Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65 and similar... and BGA Planting Kit for Nokia, Siemens, SonyEricsson it's proffesional stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson. Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. This set can work with 6 different chips as Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar..., CPU do SE T230, T610, T630 and similar..., Dialog do Siemensow serii x65 and similar..., CPU Siemens C55, C60, MC60 and similar..., UEM in Nokia phones, CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar... available here: http://www.gsm-technology.com/index....id_gr,179.html |
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