Bga pad repair - Page 3 - GSM-Forum

Halim_xu · 03-29-2011, 08:21

Quote:

Originally Posted by pentu

if the pad is not connected by any track, you can ignore it and go ahead with BGA ic replacement. the pad you have circled is also a dummy pad.

Hi. Mr.Pentu, Kujov and all

first i've to thank you to giving me informations about bga pad repair, i wanna tell you that i've done my v3000 bga pad well, the losed dummy pad i just ignored as mr.Pentu suggested, so it's really a dummy one,,.and gave me a lot of worried..but now it's working / alive, really thanks for you all, may *** bless you...

Halim_xu · 03-30-2011, 14:43

Hi Mr.Pentu,

after finish reballed v3000 compaq, do i need to upgrade the bios? seems many other threads suggest to upgrde it, is it important? and is it fine to use copper pad for bga chip?thanks

pentu · 03-31-2011, 11:47

Quote:

Originally Posted by Halim_xu

Hi Mr.Pentu,

after finish reballed v3000 compaq, do i need to upgrade the bios? seems many other threads suggest to upgrde it, is it important? and is it fine to use copper pad for bga chip?thanks

you can upgrade the bios, be carefull while doing laptop might go dead. many websites and people suggest copper pad to be used for nvidia chip, but i have never tried, i use good thermal pads and it has never given me problem, the problem is never reball and use old chip this generates lot of heat because BGA chip is exposed to thermal stress lot of time while reballing process,

while removing
while reballing
while re-soldering the chip

any chip which goes through will lose some percentage of performance.

always replace the bga chip with new one and no head ache of the laptops returning for rework again and again.

Kujoy · 03-31-2011, 22:19

Hi Halim, I have always used copper and artic silver MX2 thermal compound when reworking a chip. Pentu is right that its definately best to replace the chip if you can, but this isnt always an option. Copper does reduce the running temps and adds a little more pressure to the chip if you get ones the right thickness, silicone pads allow more movement as the chip heats and cools. If using copper put some kapton tape over the components on top of the chip. Also copper shims are hard to fit under some heatsinks, HP TX2000 is a good example.

Kujoy · 03-31-2011, 22:30

When reworking a chip you need to keep the thermal stresses to a minimum. I always warm the chip before sticking a soldering on it for example and be very careful to make sure the chip is dry. When cleaning the old solder off use plenty of quality flux that will take the temp of the soldering iron without burning and add lead solder to bring the melting point of the lead free down. I tend to use a blade tip at about 300 deg C, i know others that use 325 deg C without any problems but you have to work quickly. Hope that helps.

Halim_xu · 04-09-2011, 10:25

Quote:

Originally Posted by Kujoy

Hi Halim, I have always used copper and artic silver MX2 thermal compound when reworking a chip. Pentu is right that its definately best to replace the chip if you can, but this isnt always an option. Copper does reduce the running temps and adds a little more pressure to the chip if you get ones the right thickness, silicone pads allow more movement as the chip heats and cools. If using copper put some kapton tape over the components on top of the chip. Also copper shims are hard to fit under some heatsinks, HP TX2000 is a good example.

Hi.Mr.Kujov,

Copper really reduce the heat as we can feel that the ****ed out wind from inside laptop is not really hot as before..anyway some say the copper can cause fail for use in laptop,,pls see in this link Doubleclickittofixit.com Laptop Motherboard Reflow Repair Service tq

Twinbird · 04-24-2011, 03:28

Quote:

Originally Posted by pentu

if the pad is not connected by any track, you can ignore it and go ahead with BGA ic replacement. the pad you have circled is also a dummy pad.

A pad like this may still have an integral via, no? On a PS3 I had reballed, there were two lifted pads on the motherboard that were not connected to a trace or a via beside the pad... the PS3 still had the YLoD after reflowing the chip back on.

For my work I use the ACHI IR-PRO SC, Aoyue 968 and T-8280 machines.

If anyone has had success repairing lifted pads on Xbox 360s or PS3s, please post pictures and more info on how you did it.

I will be trying the method described here.

Thank you!

BWET · 11-14-2012, 23:56

One place where I found a good "how to video" on pad repair is :

PCB Pad Repair Video | BEST, Inc. - YouTube

Bob

endruw15 · 02-13-2017, 10:08

I have and Intel rg82855om nirthbridge ,and when i desoldered it i lifted 3 pads, Oone of them is a vss so i dont care it ,but the two other is a hi4 and hi8 wich means Hub Interface for Cmos IO or simply Hub Interface ,is it vital or not? I very thankful if anyone can help me

endruw15 · 02-13-2017, 13:03

Mr. Pentu i heard you have much experience ,if you have any idea about the two pads i'll be very thankful.

fulviospano · 02-13-2017, 21:25

If you have a microscope or a good lens you can see if there were places where there is a dot, if it were to be no means are not used.

soldertraining · 03-22-2017, 12:32

If BGA pads or traces have been damaged due to improper part removal techniques or mechanical "digging" into the circuit board, Various certified companies can repair these damaged circuit patterns to as a "good as new" condition. If a critical area array device needs to have its pads and or traces repaired prior to reballing then these can also be repaired usingh proper tools.

02-13-2017, 10:08	#39 (permalink)
endruw15 Junior Member Join Date: Feb 2017 Posts: 2 Member: 2683809 Status: Offline Thanks Meter: 0	BGA pad I have and Intel rg82855om nirthbridge ,and when i desoldered it i lifted 3 pads, Oone of them is a vss so i dont care it ,but the two other is a hi4 and hi8 wich means Hub Interface for Cmos IO or simply Hub Interface ,is it vital or not? I very thankful if anyone can help me

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03-30-2011, 14:43	#32 (permalink)
Halim_xu Crazy Poster Join Date: Dec 2010 Posts: 50 Member: 1481034 Status: Offline Sonork: Halim_Xu Thanks Meter: 3	Hi Mr.Pentu, after finish reballed v3000 compaq, do i need to upgrade the bios? seems many other threads suggest to upgrde it, is it important? and is it fine to use copper pad for bga chip?thanks

03-31-2011, 22:19	#34 (permalink)
Kujoy Major Poster Join Date: Apr 2010 Location: Scarborough, United Kingdon. Age: 54 Posts: 41 Member: 1285693 Status: Offline Thanks Meter: 5	Hi Halim, I have always used copper and artic silver MX2 thermal compound when reworking a chip. Pentu is right that its definately best to replace the chip if you can, but this isnt always an option. Copper does reduce the running temps and adds a little more pressure to the chip if you get ones the right thickness, silicone pads allow more movement as the chip heats and cools. If using copper put some kapton tape over the components on top of the chip. Also copper shims are hard to fit under some heatsinks, HP TX2000 is a good example.

03-31-2011, 22:30	#35 (permalink)
Kujoy Major Poster Join Date: Apr 2010 Location: Scarborough, United Kingdon. Age: 54 Posts: 41 Member: 1285693 Status: Offline Thanks Meter: 5	When reworking a chip you need to keep the thermal stresses to a minimum. I always warm the chip before sticking a soldering on it for example and be very careful to make sure the chip is dry. When cleaning the old solder off use plenty of quality flux that will take the temp of the soldering iron without burning and add lead solder to bring the melting point of the lead free down. I tend to use a blade tip at about 300 deg C, i know others that use 325 deg C without any problems but you have to work quickly. Hope that helps.

11-14-2012, 23:56	#38 (permalink)
BWET Junior Member Join Date: Nov 2012 Posts: 1 Member: 1839547 Status: Offline Thanks Meter: 0	One place where I found a good "how to video" on pad repair is : PCB Pad Repair Video \| BEST, Inc. - YouTube Bob

02-13-2017, 13:03	#40 (permalink)
endruw15 Junior Member Join Date: Feb 2017 Posts: 2 Member: 2683809 Status: Offline Thanks Meter: 0	Mr. Pentu i heard you have much experience ,if you have any idea about the two pads i'll be very thankful.

02-13-2017, 21:25	#41 (permalink)
fulviospano Freak Poster Join Date: Aug 2005 Location: Italy Age: 49 Posts: 121 Member: 168904 Status: Offline Thanks Meter: 23	If you have a microscope or a good lens you can see if there were places where there is a dot, if it were to be no means are not used.

03-22-2017, 12:32	#42 (permalink)
soldertraining Junior Member Join Date: Jan 2017 Location: Illinois, USA Posts: 6 Member: 2676834 Status: Offline Thanks Meter: 2	If BGA pads or traces have been damaged due to improper part removal techniques or mechanical "digging" into the circuit board, Various certified companies can repair these damaged circuit patterns to as a "good as new" condition. If a critical area array device needs to have its pads and or traces repaired prior to reballing then these can also be repaired usingh proper tools.