Re-8500

[Dan Collins]

Lets start a new thread with the RE-8500 users.

I have been very successful with the RE-8500 after many months of getting all the settings right. This system has the power to reflow without board damage because of its profile control. I repair computer motherboards, not game consoles.

I have attached the motherboard profile I have been using with great success. (change the extension from txt to jprof)

I use 3.5 as the upper heater position.

The real trick is to get a good solid hold down for the TC's. I have made a jig for mine to hold the TC's tightly. I use 2 TC's on the top next to the BGA and one on the bottom. See jpgs attached.

Laptop-LF.txt

pic1.jpg

pic2.jpg

pic3.jpg

Lets hear from other RE-8500 users

[Dan Collins]

To remove the BGA, just change the hold time to 60 seconds and wait until you hear the alarm. Then move the upper heater out of the way and pick off your BGA with the vacuum pump. When you have the chip off, stop the profile and start the fan. Easy.

One other step I always do is to park the upper heater and slide a metal plate under the board after the profile finishes and the board is below 200C to quickly stop the heat to the board. This gives a quick drop in temps which seems to help with the solder rigidness and possible overheating the board. The entire reflow should take about 5-6 minutes.

So far using this method, I have achieved a 100% success rate with no comebacks. This is assuming you are replacing BGA with new one. If you reball or just reflow, expect lower yields in the 70-90% range.

[Dan Collins]

You will also notice in pic3 from my first post that I have designed my own jig for holding the boards as well. I highly suggest making a solid support system if you want to do it right. These jigs have slideable standoffs which make board holding easy and place the board at the exact height of the stock board holder so you can use those as well for the edge of the board.

[bobo_w_p]

Thanks for the useful information’s on RE-8500. This will very helpful for me and other RE-8500 users. Keep it up brother and lets make it sticky post.

Br
Prasad.

[Dan Collins]

An update. I have now switched exclusivly using the RE-8500 for all rework. I now use my old RE7500 only for reballing BGA's. I have not had one bad reflow using the RE8500, yes 100% yield. The reason is because of the RE8500's ability to maintain the window of temperature for a set time during peak temps. It maintains 225-230C on a board for 30 seconds and never dips below or above it. This is the temp measured in 3 places.
It was a bear to maintain temps at peak with the RE7500, and if you weren't watching closely the job was a failure. Every job profiles the same way with the RE8500 and you don't even have to do anything but watch the profile do its thing. A truly automated process. I love it and now have confidence that every job will be a success. The only thing I have to concern myself with is if the replacement chip is good.

[jellytian]

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[meeky87]

Hey Dan, thanks for this helpful thread, i just want to ask you ,do you use standard or free mode??....

[Dan Collins]

meeky87: All my profile use free mode. I like to control the heaters.

[Dan Collins]

One other note. I added more TC's and now use 5. I use TC1 directly on the BGA. This gives me the ability to control the temp to the BGA to not exceed the specs. I use 3 TC's around the BGA and one on the bottom of the board. My jigs hold the TC's securely to the motherboard.

Since the RE8500 gives you 5 TC's to use, it is best to do so. More info means better control.

[Dan Collins]

Here are some quick notes to help new RE8500 users.
If Jovy reads these posts, and I suspect they do, please add this or something like this to your RE8500 Manual. How the RE8500 contols its heaters is truly a mystery until you spend many hours trying to figure it out.

TC1 is for upperside maximum heat spot. Best to use BGA non metallic land area.
TC2 is for underside of board under the BGA. Do not place on a ground plane or readings will be inaccurate.
TC3-TC5 is for reference only. No control to powers.
Preheating Stage Powers: Sets heater power until soaking stage is reached.

Preheat temp: TC1 temp until change to soaking powers.
Soak end Temp: TC1 temp until change to reflow powers.
Peak temp: TC2 Maximum temp allowed.
Peak zone time: Hold time from reaching peak temp. Reflow power is turned off after this time
Alarm temp: Only an alarm when set temp is reached on TC2. No control of powers.

During reflow cycle, system uses TC1 to control lower heater powers to match TC2 temp.

[Dan Collins]

RE8500 software wish list

1. Control right and left side heaters independently. This may be limited by hardware.
2. Show countdown timer for Peak Zone time.
3. Ability to manually control heater power during process in a Free Mode Profile.
4. Create another text field, like Profile Name, in the profile for upper heater height setting.
5. Release the source code so we can do our own thing.

Here is a biggie that would really automate the process.
Set a timeframe for Peak Zone Time in a Standard Profile. Anotherwords, have a time setting in a Standard Profile that sets the time you wish to hit peak temp. ie, 100 secs. Let Jovy control the powers to achieve the desired profile. The only variable would be your upper heater height setting. They can have a test mode where the height is tested for the optimal profile and give results if it is needed to raise or lower the heater. This one feature would make the RE8500 the most advanced reflow machine in the market under $10K. Jovy is real close to this ability using a standard profile, but now you have to set it up and use the upper heater height to determine your Peak Temp Time. If they automated the Peak Time, they could simplify running the profile. Also suggestion #4 above is needed so we know what setting to use for the created profile.
Better yet have the next generation machine have a motor controlled upper heater height.

[dexterlt]

Interesting notes. Jovy thermocouple placement guide tells the following: "TC1 beside the targeted component.
TC2 underside the targeted component.
Both the 2 thermocouple is essential to Run the
process."

I'm new user of RE-8500 and my experience is not long with the station. Is it only a mistake in guide or every user can make his own interpretation of using soldering station ?

[Dan Collins]

I have been trying standard profiles and I am very please with the results. The only thing you need to watch for is the upper heater placement which for the stock "PC mother board" profile I place the upper heater at position 3.5. I want my peak to come in at about 4 minutes and that setting seems to provide this. The standard profile seems to control the upper heater power very nicely. I would like to see the power settings in the Process Analysis so I know what power settings they used. Currently they are blank.
Here is a look at the profile I achived. TC1 which is on the BGA never exceeded 237C (I set max temp to 235C)

[myfriend]

Hi.. I'm very interested in Jovy Re8500
I wonder if it can use for repair iPhone IC or not?

[Dan Collins]

myfriend,
For small devices I would think the RE7500 is a better choice.