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05-23-2016, 21:23 | #61 (permalink) |
Junior Member Join Date: Apr 2013
Posts: 9
Member: 1914050 Status: Offline Sonork: 256 Thanks Meter: 5 | Lg g4-h815 |
06-30-2016, 07:27 | #62 (permalink) |
Freak Poster Join Date: Feb 2011
Posts: 156
Member: 1514778 Status: Offline Thanks Meter: 48 | Theres no easy fix for that, if you want to really fix it you will have to replace the emmc chip on the motherboard. Maybe reballing it will do it but best bet is to replace it. Theres a big issue with LG G4s on the emmc solder joints. Since the new policy on no lead solder has been implemented companies are struggling a lot to keep up with that. Just like the Iphone 6 and 6plus that end up losing touch because of a stupid fall of the phone and or bend. Some just simply because of the constant temperature changing on a cell phone. Solder joints will crack, and or oxidize to the point were theyre no longer reliable. Emmc swap is the way to fix it the right way like it or not. Good luck with that m8 |
07-18-2016, 15:42 | #64 (permalink) |
Junior Member Join Date: Jan 2016 Location: Estonia Tallinn
Posts: 23
Member: 2517410 Status: Offline Thanks Meter: 6 | My SOLUTION was: So as not make things worse initially, and would need to first make a copy of the data. Then use first this metode temporary (get data out off phone) is cool town moderboard with vacumcleaner or compressed air. This CPU take bootloop if outside/surface temperature is over 70* (the internal temperature is much higher than the surface) (air cool town, stable temperature ~30*C (CPU-Z all sensors show: 25*C)) (if temperature rise of metal / material expands (and may be lost tin contact)) (My device doing reboot/bootloop when CPU-Z sensors show: ~35*C) Service manual LG-H815 page 96 ("9. PCB LAYOUT") is writed problem chip: U2100(MSM8992)(is layered beneath the RAM: U3100 (~3GB)) / U3200(eMMC)(NAND Flash (~32GB)) if device "No Booting/Crash" So it may be a problem in the three chip (in one of them or in all). While there may be a problem, not a tin or soldering, but inside the the chip or motherboard (However, the heating can improve the contacts (deformed by the heat) (or make worse)) (My device: U3100 is chip: SKhynix LPDDR3 H9CKNNNDATMTDR-NUH FBGA(216ball), 12mm×12mm, 8Bank, 1.8V/1.2V/1.2V, 24Gb, 192Mx32, speed 1866) (My device: U3200is chip: 1516KAE THGBMFG8C4LBAIR VE9536 CHINA) My chip picture bad work LG G4 H815 LG-H815 goo. gl/photos/HYHWGbS7NQit5Fnk6 and goo. gl/photos/Vt88Do4uxB7gR65X9 temporary (get data out off phone) is cool town moderboard with vacumcleaner or compressed air. This CPU take bootloop if outside/surface temperature is over 70* (the internal temperature is much higher than the surface) (air cool town, stable temperature ~30*C) (if temperature rise of metal / material expands (and may be lost tin contact)) reheat CPU(&MEM) solderballs xda-developers. com/g4/help/diy-h815-usa-variant-hardware-boot-loop-t3311623 or reball youtube. com/watch?v=F02SgZN4L1Y If you can repire device, then use cool down helper: thermal compound & termal pads FBGA 216ball package (Adhesive-bonded/poxy) Underfill CTE mismatch is a big problem for flip- chip assembly, the thermo-mechanical stress breaks solder bumps. The solution is to add some underfill between the die and the substrate. Underfill resins are loaded with silica and have CTE around 30ppm / K Technical aspects23 google. com/search?tbm=isch&q=Underfill+pop (without spaces mega . nz / #!SI10marY! C0wMUTDTDp8gNiGaoeRWQ5PvKpwna9okJpo - AS7OO28 ifixit. com/Teardown/LG+G4+Teardown/42705 (This device: U3100 is chip: SKhynix LPDDR3 H9CKNNNDATMTDR-NUH FBGA(216ball), 12mm×12mm, 8Bank, 1.8V/1.2V/1.2V, 24Gb, 192Mx32, speed 1866) (This device: U3200 is chip: 1516KAE THGBMFG8C4LBAIR VE9536 CHINA) ( This device: U2100 is Qualcomm Snapdragon 808 (s808 / MSM8992)) |
10-18-2016, 14:09 | #67 (permalink) |
Freak Poster Join Date: May 2012
Posts: 143
Member: 1754544 Status: Offline Sonork: chetan Thanks Meter: 20 | Hello friends Before a week i completed LG h815 hang on logo. its not Hardware, its software problem Download the LG flash tool, Download Proper flash file(.kdz), Driver properly install and flash with tool during the flash dilogue box display one or two time read instructions carefully. and Note this Flashing process running and display any dialogue box dont do any thing until flash process completed. your problem will solve 100000%%%% https://www.4shared.com/zip/mOO6LVli...Tool-2014.html https://www.4shared.com/zip/WxWrsHrJ..._Firmware.html above flash tool i used for download firmware and flashing Enjoy Last edited by nrcmobile2010; 10-18-2016 at 14:17. |
11-30-2016, 18:23 | #69 (permalink) | |
Freak Poster Join Date: Dec 2004 Location: Serbia, Belgrade
Posts: 182
Member: 100105 Status: Offline Thanks Meter: 24 | LG H815 boot loop Quote:
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10-12-2017, 11:24 | #71 (permalink) |
Freak Poster Join Date: Jun 2007 Location: pakistan
Posts: 235
Member: 525998 Status: Offline Thanks Meter: 57 | hey i got some problem restart again and again ....some one tell me that its a battery problem ...change the battery its will be okey ....LG mobile has a 70% chance to slove the problem with battery !!! |
11-16-2017, 13:06 | #72 (permalink) |
Junior Member Join Date: Sep 2017 Location: India Now Working in Kuwait Age: 45
Posts: 7
Member: 2761097 Status: Offline Thanks Meter: 0 | Dear All, If got this issue ..... 1st : Clean charging Port & check, 2nd : If same then replace battery & check, Then also same it will be hardware problem its CPU (POP IC) Just re-hot 10-15 sec CPU some time it will be OK If Replace CPU also Successes ratio just 50% only Better Swap Motherboard. |
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