Cleaning pads after BGA desoldering - GSM-Forum

WebScript · 05-24-2015, 15:19

Hello. I have one iPhone 5S that needs U2 chip replace. I will use hot air desoldering station to desolder the chip from the board. My question is what are the possible issues? I heard about baseband chip not working after too much heating. What temperature should I use? I think that I will use slowest speed possible. Is it right? After desoldering I will clean the pads on the board. Can I use desoldering wick or it will tear the pads from the board? What are my options in cleaning the board? I have done many SMD and THT soldering before. Thank you.

kaptanci · 05-24-2015, 19:32

Iphone 5s is easy. I use 300 c high air flow The only danger if u use high air flow is ****ing away other components. If u cover other components it dont happen. never use wick. U can use soldering iron with solder to clean pads. flux is very important. Dont use the soldering iron for long time for cleaning pads. U can heat the entire board at 190 c before u start desoldering. pcb holder is not good. Good luck.

05-24-2015, 15:19	#1 (permalink)
WebScript Junior Member Join Date: May 2015 Posts: 11 Member: 2398666 Status: Offline Thanks Meter: 2	Cleaning pads after BGA desoldering Hello. I have one iPhone 5S that needs U2 chip replace. I will use hot air desoldering station to desolder the chip from the board. My question is what are the possible issues? I heard about baseband chip not working after too much heating. What temperature should I use? I think that I will use slowest speed possible. Is it right? After desoldering I will clean the pads on the board. Can I use desoldering wick or it will tear the pads from the board? What are my options in cleaning the board? I have done many SMD and THT soldering before. Thank you.

05-24-2015, 19:32	#2 (permalink)
kaptanci Freak Poster Join Date: Nov 2014 Location: Germany Posts: 265 Member: 2289832 Status: Offline Thanks Meter: 48	Iphone 5s is easy. I use 300 c high air flow The only danger if u use high air flow is ****ing away other components. If u cover other components it dont happen. never use wick. U can use soldering iron with solder to clean pads. flux is very important. Dont use the soldering iron for long time for cleaning pads. U can heat the entire board at 190 c before u start desoldering. pcb holder is not good. Good luck.