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05-22-2012, 11:34
| #1 (permalink) |
| Junior Member  Join Date: May 2012
Posts: 19
Member: 1762507 Status: Offline Thanks Meter: 1 | Iphone 4 hardware problem rebooting during restore  |
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05-23-2012, 09:33
| #4 (permalink) |
| Freak Poster Join Date: Mar 2012 Location: Italy
Posts: 219
Member: 1741592 Status: Offline Thanks Meter: 26 | nope it has only a few and very big balls, but apple used a lot of glue on it, it's hard to lift |
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| The Following User Says Thank You to seve91 For This Useful Post: |
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05-24-2012, 19:38
| #6 (permalink) |
| Freak Poster  Join Date: Dec 2011 Location: damak,jhapa,nepal
Posts: 330
Member: 1705433 Status: Offline Sonork: kali Thanks Meter: 45 | you use 280 degree & u need glue remover paste or very carefully clean first glue and remove,u will be success |
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| The Following User Says Thank You to kali_fuchi For This Useful Post: |
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05-24-2012, 20:44
| #7 (permalink) |
| Freak Poster Join Date: Mar 2012 Location: Italy
Posts: 219
Member: 1741592 Status: Offline Thanks Meter: 26 | usually i use 200°C measured on the BGA, then put some gel flux around the IC, wait some sec, then use a nail and scrap all the glue around the IC. Then the heat will better goes under the IC, you will need a lower temp to lift the bga then. If you can see the nearby component solder melting, try to gently move the BGA, if not wait some sec and retry! try also to lift it with a tweezer or something else, but pry it gently  |
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| The Following User Says Thank You to seve91 For This Useful Post: |
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