Hot air temperature to desolder backlight IC iPhone 6 - GSM-Forum

dadisigoi · 12-23-2016, 09:36

i use 370c sometimes i remove some line tkhx

harhar01 · 12-25-2016, 13:27

first remove glue around the ic with low heat (200 C) and tweezers then peel off the top black top layer of the ic untill you see the crystal then put some tin on soldering iron and some flux on the ic then heat the ic with the soldering iron and gentley pulling up the ic with the tweezers until its desoldered then clen the glue bitween pads with tweezers and low heat.
send me PM if you need a movie to this operation.

phoneparts@hotm · 02-16-2017, 01:03

Each rework station will give different heats.. I have noticed..
Current work station heat station iam using iam using heat on 410 and air on setting 2.
Using heat tape over other components will help. And freezer spray to hand 2. The I. C will desoilder with flux within 5 seconds. But remember high heat temp for long time can have a damaging effect on your main board. Hope this helps.

short_toground · 02-16-2017, 04:47

Quote:

Originally Posted by harhar01

first remove glue around the ic with low heat (200 C) and tweezers then peel off the top black top layer of the ic untill you see the crystal then put some tin on soldering iron and some flux on the ic then heat the ic with the soldering iron and gentley pulling up the ic with the tweezers until its desoldered then clen the glue bitween pads with tweezers and low heat.
send me PM if you need a movie to this operation.

What's your method for pmic removal without too much heat going to CPU causing solder balls to squeeze out

Kradziej · 02-17-2017, 19:02

380/90 on quick 861dw ;]
and dont pull forcefully just wait for glue to soft

12-23-2016, 09:36	#1 (permalink)
dadisigoi Freak Poster Join Date: Apr 2010 Age: 39 Posts: 113 Member: 1286421 Status: Offline Thanks Meter: 18	Hot air temperature to desolder backlight IC iPhone 6 i use 370c sometimes i remove some line tkhx

12-25-2016, 13:27	#2 (permalink)
harhar01 Junior Member Join Date: Nov 2014 Posts: 33 Member: 2292442 Status: Offline Thanks Meter: 12	first remove glue around the ic with low heat (200 C) and tweezers then peel off the top black top layer of the ic untill you see the crystal then put some tin on soldering iron and some flux on the ic then heat the ic with the soldering iron and gentley pulling up the ic with the tweezers until its desoldered then clen the glue bitween pads with tweezers and low heat. send me PM if you need a movie to this operation.

02-16-2017, 01:03	#3 (permalink)
phoneparts@hotm Junior Member Join Date: Apr 2008 Posts: 24 Member: 750301 Status: Offline Thanks Meter: 3	Each rework station will give different heats.. I have noticed.. Current work station heat station iam using iam using heat on 410 and air on setting 2. Using heat tape over other components will help. And freezer spray to hand 2. The I. C will desoilder with flux within 5 seconds. But remember high heat temp for long time can have a damaging effect on your main board. Hope this helps.

02-17-2017, 19:02	#5 (permalink)
Kradziej Freak Poster Join Date: Sep 2015 Posts: 198 Member: 2453408 Status: Offline Thanks Meter: 63	380/90 on quick 861dw ;] and dont pull forcefully just wait for glue to soft