Problems with desoldering of iPhone Baseband

[Deltaone1]

Hi yesterday i tryed to desolder the baseband Chip for rebaling it after.
But i could not remove the Chip from the Logic Board
I tried to remove the chip with the hot air gun by 350°C and 3 Flow of Air for 2Minutes.
After that i also tryed higher °C up to 400°C but without any success, the Chip is still on the Board!

Is there somebody how could give me some tips???

i tryed severlas settings with severlas Temperaturs and Air flow, but Chip was still on the board without any moving

Up to which °C the Baseband chip can handle it without died?

Hope that anybody can help me
thx a lot

[tayyab007]

did u remove paste around ic. if not then first remove that with needle or eraser but becarefull.

[Deltaone1]

i removed it on the places where i could go to it with a needle, but i think the paste is also going melting and is not so strong that it is holding the ic... or not?

[naveedshah2]

used this station for removing pasted ic detail here
Work with these tools on apple only

[Deltaone1]

i have already a hotair rework station

[naveedshah2]

then wahts problume with you ,with sation work on pasted ic is very easy..................

[Deltaone1]

i thought that also, but i have really a problem to desolder the baseband chip from the logic board... i even tryed to desolder others ic on a testboard also bga without any problems...
but back on iPhone i still can not desolder the baseband chip from the iPhone.... (((

it is very very fuc**** i tryed the hole afternoon without any success it seems like that the baseband is fixed on the logic board with stronges superglue on the world... i try to not damage the logic board or other components so i do it slowly and try to be very very carefully.... but all without any success... i also see some discoloration on the metal around the baseband chip from the heat

So somebody have tip or advice for me????

I thought about to remove the metal-bone from the RF-Area...

Hope for some help

[Wites]

Originally Posted by Deltaone1

i thought that also, but i have really a problem to desolder the baseband chip from the logic board... i even tryed to desolder others ic on a testboard also bga without any problems...
but back on iPhone i still can not desolder the baseband chip from the iPhone.... (((

it is very very fuc**** i tryed the hole afternoon without any success it seems like that the baseband is fixed on the logic board with stronges superglue on the world... i try to not damage the logic board or other components so i do it slowly and try to be very very carefully.... but all without any success... i also see some discoloration on the metal around the baseband chip from the heat

So somebody have tip or advice for me????

I thought about to remove the metal-bone from the RF-Area...

Hope for some help

This because paste hold the ic very good,don't give more than 380C of heat.
Try again when you see components around move,reliance on metallic part using tweezers when ready pry it up make like in photo.
http://i41.tinypic.com/210ho1v.jpg
Don't blame me if you do some mistake.

[Deltaone1]

Ok i will give it a try again today... i will report my results

[Geronino]

i've the same problems with the glued ICs on iPhone mainboards.
All the not glued ICs are very easy to desolder, but the glued ones are really hard to remove.
First i've tried to make it physically with a knife or something else to remove the glue, but it's not really working.
I've heard about a fluid to remove the glue?
I've tried it with aceton, which is the most agressive fluid i have, but it's not working.
It works if i heat it up with 450°C for a long time, but that will damage all little parts around if you're not carefull.
So anyone knows a solution for that?

thanks regard

[karmannolet1]

try whit remover paint gel used in automotive industry for body shops is very easy to remove the epoxic

[Deltaone1]

so my results of desoldering baseband:
i tryed first to remove the glue with hot it up to 180°C and remove it with a nedle, but the problem is that the glue is also under the IC and the IC is thatfor very hard to remove because it fixed very well with this glue, i heat up the ic area up to 380°C and pushed it with a nedle up an the IC was gone, but the problem now is that with the IC some conections-pads on the Logic board are also gone, so now after cleaing i recogice that they are maybe 20pads missing on the Logic board (((

[Deltaone1]

so how they do it without break the ic or the board and without overheat other components.... please some instructions for next time....

[Wites]

Originally Posted by Deltaone1

so how they do it without break the ic or the board and without overheat other components.... please some instructions for next time....

There are unused prints if they not have an track or coper dot under it then it is null no need to worry,reball and solder back.
Or post a photo zoomed in that area i will look and tell you if some important removed.