Replace fpc with hot air - GSM-Forum

stratf01 · 10-18-2017, 21:47

Hi wondered if i could get some advice on replacing fpc connectors please?
I have watched videos of those only using hot air to remove connectors quickly and still in one piece. Some doing so with no flux.
I have found so far that more heat is better to melt solder before melting the plastic. And that a quick removal is better than spending too much time at it.
My concern is overheating the board and any components on other side of pcb.
I know that many use low melt solder before hot air as I have in past but sometimes the clearance is so tight it's difficult not to get the solder on other components.

Do you use less, more or your usual airflow to remove fpc?
Do you use normal nozzle or bigger? (I use 6mm)
Are there certain fpc you need to be particularly careful with because of components possibly getting fried on other side?
Be so grateful for your thoughts and suggestions.
Thanks
Chris.

sunny_lad · 10-19-2017, 00:02

The fpc connectors on the iPhone 6 and onwards are made of very strong plastic.
Usually you can take them off without bur in the plastic.
The topic of nozzle size, heat and airflow I think just depends on different tools and personal experience.
Just make sure you take all the rubber seal off the components surrounding the connector. When you taking the connector off you don't need flux. Afterwards clean it properly and then put another one on.

Sent from my ONEPLUS A3003 using Tapatalk

aries20 · 10-19-2017, 00:21

What welder do you use or recommend for soldering female FPC connector and damage caused by long screws?

Enviado desde mi HTC One_M8 mediante Tapatalk

10-18-2017, 21:47	#1 (permalink)
stratf01 Crazy Poster Join Date: Nov 2015 Posts: 50 Member: 2487844 Status: Offline Thanks Meter: 6	Replace fpc with hot air Hi wondered if i could get some advice on replacing fpc connectors please? I have watched videos of those only using hot air to remove connectors quickly and still in one piece. Some doing so with no flux. I have found so far that more heat is better to melt solder before melting the plastic. And that a quick removal is better than spending too much time at it. My concern is overheating the board and any components on other side of pcb. I know that many use low melt solder before hot air as I have in past but sometimes the clearance is so tight it's difficult not to get the solder on other components. Do you use less, more or your usual airflow to remove fpc? Do you use normal nozzle or bigger? (I use 6mm) Are there certain fpc you need to be particularly careful with because of components possibly getting fried on other side? Be so grateful for your thoughts and suggestions. Thanks Chris.

10-19-2017, 00:02	#2 (permalink)
sunny_lad Insane Poster Join Date: Jan 2014 Posts: 87 Member: 2110834 Status: Offline Thanks Meter: 9	The fpc connectors on the iPhone 6 and onwards are made of very strong plastic. Usually you can take them off without bur in the plastic. The topic of nozzle size, heat and airflow I think just depends on different tools and personal experience. Just make sure you take all the rubber seal off the components surrounding the connector. When you taking the connector off you don't need flux. Afterwards clean it properly and then put another one on. Sent from my ONEPLUS A3003 using Tapatalk

10-19-2017, 00:21	#3 (permalink)
aries20 Freak Poster Join Date: Feb 2010 Posts: 103 Member: 1247453 Status: Offline Thanks Meter: 13	What welder do you use or recommend for soldering female FPC connector and damage caused by long screws? Enviado desde mi HTC One_M8 mediante Tapatalk