how to reheat ics

[wodashie]

Hi all, could someone please share his knowledge on the suitable temperature range to operate the hot air rework stations in reheating ics of blackberries which wouldn't render the device dead???

my reason for asking this help is i've read sometimes on this forum, suggestion to people who needs help with dead/shorting bbs to reheat ics.

first what's unclear to me is which ic to reheat and secondly which safe temperature to use as from my little experience with bbs, they are very heat sensitive.

if you have any material or video on the safe temperature ranges in reheating blackberry ics, please share.

thanx and best wishes

[clebo]

bro you would need to prctice because everyone has different procedure the follow when heating

some use a preheater
then the hotair station
i set mine to 350'c

[wodashie]

Originally Posted by clebo

bro you would need to prctice because everyone has different procedure the follow when heating

some use a preheater
then the hotair station
i set mine to 350'c

appreciate your assistance. i know too well it will take practicing hence want to gleen from some of you who have accummulated some experience practicing with it for sometime.

could someone also please share his experience as to the safest temperature range that's worked for them working on bbs???

best wishes

[garry_b]

yes please looking forward to your expewriences.

[ucokmonalisa]

PHP Code:

wodashie
how to reheat ics 


Hi all, could someone please share his knowledge on the suitable temperature range to operate the hot air rework stations in reheating ics of blackberries which wouldn't render the device dead???

my reason for asking this help is i've read sometimes on this forum, suggestion to people who needs help with dead/shorting bbs to reheat ics.

first what's unclear to me is which ic to reheat and secondly which safe temperature to use as from my little experience with bbs, they are very heat sensitive.

if you have any material or video on the safe temperature ranges in reheating blackberry ics, please share.

thanx and best wishes

HOW TO USE ****ER

Solder steam useful to remove, install, print and re-soldering the components, both SMD (centipedes), BGA (ball-ball lead) and other minor components. Re-heat the soldering process or to improve the IC legs are the legs of ic which may be less attached to the PWB (Print Wired Board) and not to repair a damaged IC. Temperature and air pressure on the solder vapor must be considered so as not to damage the phone PWB, solder in the use of steam required precision, patience, thoroughness and accuracy. How to hold the solder vapors must be strong and perpendicular to the component. . .

USE OF AIR ENGINEERING Soldering (****ER)

A. ****er Glance
****er is one variant of Solder. Called for the use of ****ers using air. In the standard ****er used in the lab, there are two settings. The first setting is the thermal power (heating) to be issued through the eyes of solder, and other settings is the pressure (force gusts) air to be emitted. Both linear regulators are working with each other. The higher the temperature the air is emitted, it will grow strong again if the pressure is raised uadara to be issued ..
The ****er is used specifications are:
A. Steam Welding Solder Remover for soldering and desoldering of very small SMD components
2. Shirts can be used to heat the tube,
3. heat energy and heat processing test
4. Temperature can be set from 100C to 540C
5. Anti-static with a circuit component damage to mlindungi

B. The use of techniques ****er
Use of this ****er is quite simple. In the application process pnyolderan components, ****er holds exactly the same way by holding regular solder. The main advantages of this ****er is melelhkan issued tin with air, not with an iron rod used in ordinary solder. As for how to use these ****ers are:
A. Pair contact ****er to the main outlet (two-eyed flat), This will result in noise on the ****er is turned off (off). This is due to the cooling ****er is on hardware.
2. Press the ON position, to run the ****er function. Noise will disappear.
3. After ****er On, we can adjust the settings found on the ****er. The first setting is a Heating (heat / temperature), while the second is the air pressure regulation to be issued.
4. Turn the heat setting at the desired temperature, such as 200 degrees C. Temperature of 200 degrees C will be generated, but will not be felt at the end of the solder if air pressure is removed is positioned 0.
5. Adjust the air pressure as desired, as in position 1, 2, 3 or the other. 200 º C air will be exhaled and felt the heat is removed.
6. In circumstances as above, the ****er can be used to keparluan desired. The use of ****er is dependent upon the type of device that will diselder, because it will relate to the setting of heat and air pressure ****er.
C. Using ****er to open the IC Mobile (IC Leg Looks)
As in previous guidance, we can use a ****er fatherly IC leg opening that can not be opened with ordinary solder. IC-IC is widely available in computer devices, mobile phones, devices and other technologies. How to use:
A. ****er settings as needed kompone yan will be opened.
2. Prepare a pair of tweezers to hold / pull the components that we will open.
3. Oleskanlah anti hot liquid that has been available (commercially available) in the circuit or component that will be on the ****er, like the surface of the IC to be opened.
4. Use a ****er to melelhkan tin-lead attached to the foot of the IC and the circuit board. ****er directing the eye to the legs.
5. Spray the air ****er hinga Tin completely melted, do not pull the component with tweezers too strong, because it will cause damage to the lead track on the circuit board.
6. Once completely melted tin, body rocking with oinset IC, the IC will be lifted from the circuit board.
7. IC was the opening process has been completed.

D. Changing techniques Feet IC Mobile
Tools needed:
A. Foot Archery IC devices:
a. PCB board holder mobile device, usually consisting of two pieces of steel plate that has a magnetic steel, and base board made of iron and has a hole that is used to place the IC (various sizes) at the time of application of tin.
2. Solder steam, used to open and install the IC legs
3. Solder always, used to clean fatherly IC legs and feet phone PCB.
4. A set of HP screwdriver, to open the phone.
5. Printer BGA IC, IC foot print that will be attached to the Mobile.
6. PCB Cleaner Boxes, Shoe tin scattered on former IC PCB opened.
7. Tweezers, to hold and lift the IC to be mounted or open.
8. Cottonbut cotton swab or, to put fluids in open and install diguankan IC. The liquid consists of:
a. IPA liquid
b. Fluid Flux
c. Fluid Sionka
9. Paste tin / lead wire / lead ball

Installation of IC techniques:
A. Solder the use of Steam
Solder steam useful to remove, install, print and re-soldering the components, both SMD (centipedes), BGA (ball-ball lead) and other minor components. Re-heat the soldering process or to improve the IC legs are the legs of ic which may be less attached to the PWB (Print Wired Board) and not to repair a damaged IC. Temperature and air pressure on the solder vapor must be considered so as not to damage the phone PWB, solder in the use of steam required precision, patience, thoroughness and accuracy. How to hold the solder vapors must be strong and perpendicular to the component that will be done, for IC BGA wind direction should be perpendicular and not be tilted except in the drying process the liquid, as it would have resulted tin balls located at the bottom of the IC can be fused and cause shorting and should be lifted, siongka Use liquid or liquid flux to accelerate the melting of tin and prevent damage to the IC. This fluid is placed on the top of IC or IC into the gap. The length of the ****er also berpariasi by heat setting is used and the material components, if the IC is usually 3 â € "7 seconds while the plastic component 10 â €" 20 seconds with hot temperatures are reduced.
2. Solder Steam settings
Condition C Air Pressure-Temperature
a. Remove fluid (dry) 100-200 8
b. Heat / melt the lead from the top positions 350-400 3
c. Heat / melt the tin from the bottom position 350-400 3
d. Lifting and installing the components 350-400 3
e. Flexibel lifted from PWB 250-300 3
f. Lifting the plastic components 250-275 3
g. IC foot print 3 350-400

3. BGA IC foot print
Foot prints BGA IC (IC-legged balls of tin)
a. Prepare the IC molding tools, Tin Paste, insulation paper, cuter blades, solder vapors, tweezers and a liquid IPA
b. attach to the bottom of the IC that you want to print the legs, to the printing press
IC, make sure all the ic leg holes according to the printer device
ic, paste the solasi that position has not changed, the input of lead paste it into the hole â € "a small hole in the printing press just above IC IC that will be reproduced with a uniform, heat the IC to lead paste had been transformed into a shiny like tin ball,
c. Wait a while
d. Unplug it from the mold IC IC bga and wash with liquid IPA
e.
4. Removing the BGA IC on the PWB phonsel
Releasing steps BGA IC:
a. Apply liquid flux above the IC
b. Prepare to lift IC pincet
c. Heat the IC is approximately approximately 1.5 cm above the IC
d. Shake the IC with tweezers, to ascertain whether the lead on the IC leg was broken.
b. If the IC is in motion, lift ic with tweezers
c. Clean the PWB from the rest of the tin is left to ordinary solder.

5. Replacing the IC BGA on PWB phonsel
Steps to install IC BGA
a. Clean the surface of the PWB from the rest of the tin is left
b. Apply liquid flux to the PWB
c. Take and place the IC which we will post, make sure the point on the IC is not upside down (see picture in the book where the position of the line, if you forget)
b. make sure all the sides and elbows straight IC on the printed lines in the PWB, and solder heat with steam, is approximately less than 2 cm from the IC, and adjust the temperature set aside some time to return the IC to cool.

6. Removing the plastic components
Components made of plastic is a combustible components and melt when exposed to heat. The use of steam is too hot solder will cause the plastic component is damaged. Adjust the heat to the soldering temperature steam 200UC â € "210UC with airflow 4 â €" 8, the arrangement usually does not cause plastic components to melt but it takes much longer than the removal or heating the IC. Direction of the solder vapor / ****er fixed on the components contained lead and tin are melted as soon as the plastic component is removed from the PCB, it will slightly melt the plastic on the surface but not a problem. After removal, note the wall in the edge connector should be carefully examined in the points that have metal contacts. Menyarap metal contact will heat up rapidly and melt lead. If it fails, then you must lower the temperature a little lower, this is due to differences in the solder used steam.

Sources: alergi.co.cc / By Muhammad Ihsan Zul

http://www.wahanaponsel.com/rajapons...C%20Ponsel.pdf

and Google Translate

[ucokmonalisa]

here bro link may be help you :
BGA Reballing-Device Deballing Using Solder Wick ! BEST Inc - YouTube
http://www.youtube.com/watch?v=nc3_0b2gigM
Process of Reballing- Motherboard Laptop Repair - YouTube
REBALLING TX1000 DV6000 V3000 MÉXICO NVIDIA G6150 GARANTÍA 7 MESES POR ESCRITO - YouTube
BGA reworking without special reballing equippment - YouTube
Wii Epoxy Removal - From Ozmodchips - YouTube
how to remove epoxy resin and smd chips - YouTube
Glue Remove - YouTube
HP tx1000 no boot / black screen / motherboard repair - YouTube
http://www.youtube.com/watch?v=JawDu89P29s

[The Repair Shop]

I use about 350 for the heat, and lots off good flux. When you reheat all ways keep the nozzle moving if you don't that's when you burn things very easy. And keep and eye on the components neat the ic you are heating, when solder starts to shine on them that's when to stop.

[garry_b]

yess but lets see how can i remove the metal part from blackberry i ahve a desoldering station??

[The Repair Shop]

Don't run before you can walk;-)

[psytr0nic]

Originally Posted by ucokmonalisa

HOW TO USE ****ER

Solder steam useful to remove, install, print and re-soldering the components, both SMD (centipedes), BGA (ball-ball lead) and other minor components. Re-heat the soldering process or to improve the IC legs are the legs of ic which may be less attached to the PWB (Print Wired Board) and not to repair a damaged IC. Temperature and air pressure on the solder vapor must be considered so as not to damage the phone PWB, solder in the use of steam required precision, patience, thoroughness and accuracy. How to hold the solder vapors must be strong and perpendicular to the component. . .

USE OF AIR ENGINEERING Soldering (****ER)

A. ****er Glance
****er is one variant of Solder. Called for the use of ****ers using air. In the standard ****er used in the lab, there are two settings. The first setting is the thermal power (heating) to be issued through the eyes of solder, and other settings is the pressure (force gusts) air to be emitted. Both linear regulators are working with each other. The higher the temperature the air is emitted, it will grow strong again if the pressure is raised uadara to be issued ..
The ****er is used specifications are:
A. Steam Welding Solder Remover for soldering and desoldering of very small SMD components
2. Shirts can be used to heat the tube,
3. heat energy and heat processing test
4. Temperature can be set from 100C to 540C
5. Anti-static with a circuit component damage to mlindungi

B. The use of techniques ****er
Use of this ****er is quite simple. In the application process pnyolderan components, ****er holds exactly the same way by holding regular solder. The main advantages of this ****er is melelhkan issued tin with air, not with an iron rod used in ordinary solder. As for how to use these ****ers are:
A. Pair contact ****er to the main outlet (two-eyed flat), This will result in noise on the ****er is turned off (off). This is due to the cooling ****er is on hardware.
2. Press the ON position, to run the ****er function. Noise will disappear.
3. After ****er On, we can adjust the settings found on the ****er. The first setting is a Heating (heat / temperature), while the second is the air pressure regulation to be issued.
4. Turn the heat setting at the desired temperature, such as 200 degrees C. Temperature of 200 degrees C will be generated, but will not be felt at the end of the solder if air pressure is removed is positioned 0.
5. Adjust the air pressure as desired, as in position 1, 2, 3 or the other. 200 º C air will be exhaled and felt the heat is removed.
6. In circumstances as above, the ****er can be used to keparluan desired. The use of ****er is dependent upon the type of device that will diselder, because it will relate to the setting of heat and air pressure ****er.
C. Using ****er to open the IC Mobile (IC Leg Looks)
As in previous guidance, we can use a ****er fatherly IC leg opening that can not be opened with ordinary solder. IC-IC is widely available in computer devices, mobile phones, devices and other technologies. How to use:
A. ****er settings as needed kompone yan will be opened.
2. Prepare a pair of tweezers to hold / pull the components that we will open.
3. Oleskanlah anti hot liquid that has been available (commercially available) in the circuit or component that will be on the ****er, like the surface of the IC to be opened.
4. Use a ****er to melelhkan tin-lead attached to the foot of the IC and the circuit board. ****er directing the eye to the legs.
5. Spray the air ****er hinga Tin completely melted, do not pull the component with tweezers too strong, because it will cause damage to the lead track on the circuit board.
6. Once completely melted tin, body rocking with oinset IC, the IC will be lifted from the circuit board.
7. IC was the opening process has been completed.

D. Changing techniques Feet IC Mobile
Tools needed:
A. Foot Archery IC devices:
a. PCB board holder mobile device, usually consisting of two pieces of steel plate that has a magnetic steel, and base board made of iron and has a hole that is used to place the IC (various sizes) at the time of application of tin.
2. Solder steam, used to open and install the IC legs
3. Solder always, used to clean fatherly IC legs and feet phone PCB.
4. A set of HP screwdriver, to open the phone.
5. Printer BGA IC, IC foot print that will be attached to the Mobile.
6. PCB Cleaner Boxes, Shoe tin scattered on former IC PCB opened.
7. Tweezers, to hold and lift the IC to be mounted or open.
8. Cottonbut cotton swab or, to put fluids in open and install diguankan IC. The liquid consists of:
a. IPA liquid
b. Fluid Flux
c. Fluid Sionka
9. Paste tin / lead wire / lead ball

Installation of IC techniques:
A. Solder the use of Steam
Solder steam useful to remove, install, print and re-soldering the components, both SMD (centipedes), BGA (ball-ball lead) and other minor components. Re-heat the soldering process or to improve the IC legs are the legs of ic which may be less attached to the PWB (Print Wired Board) and not to repair a damaged IC. Temperature and air pressure on the solder vapor must be considered so as not to damage the phone PWB, solder in the use of steam required precision, patience, thoroughness and accuracy. How to hold the solder vapors must be strong and perpendicular to the component that will be done, for IC BGA wind direction should be perpendicular and not be tilted except in the drying process the liquid, as it would have resulted tin balls located at the bottom of the IC can be fused and cause shorting and should be lifted, siongka Use liquid or liquid flux to accelerate the melting of tin and prevent damage to the IC. This fluid is placed on the top of IC or IC into the gap. The length of the ****er also berpariasi by heat setting is used and the material components, if the IC is usually 3 â € "7 seconds while the plastic component 10 â €" 20 seconds with hot temperatures are reduced.
2. Solder Steam settings
Condition C Air Pressure-Temperature
a. Remove fluid (dry) 100-200 8
b. Heat / melt the lead from the top positions 350-400 3
c. Heat / melt the tin from the bottom position 350-400 3
d. Lifting and installing the components 350-400 3
e. Flexibel lifted from PWB 250-300 3
f. Lifting the plastic components 250-275 3
g. IC foot print 3 350-400

3. BGA IC foot print
Foot prints BGA IC (IC-legged balls of tin)
a. Prepare the IC molding tools, Tin Paste, insulation paper, cuter blades, solder vapors, tweezers and a liquid IPA
b. attach to the bottom of the IC that you want to print the legs, to the printing press
IC, make sure all the ic leg holes according to the printer device
ic, paste the solasi that position has not changed, the input of lead paste it into the hole â € "a small hole in the printing press just above IC IC that will be reproduced with a uniform, heat the IC to lead paste had been transformed into a shiny like tin ball,
c. Wait a while
d. Unplug it from the mold IC IC bga and wash with liquid IPA
e.
4. Removing the BGA IC on the PWB phonsel
Releasing steps BGA IC:
a. Apply liquid flux above the IC
b. Prepare to lift IC pincet
c. Heat the IC is approximately approximately 1.5 cm above the IC
d. Shake the IC with tweezers, to ascertain whether the lead on the IC leg was broken.
b. If the IC is in motion, lift ic with tweezers
c. Clean the PWB from the rest of the tin is left to ordinary solder.

5. Replacing the IC BGA on PWB phonsel
Steps to install IC BGA
a. Clean the surface of the PWB from the rest of the tin is left
b. Apply liquid flux to the PWB
c. Take and place the IC which we will post, make sure the point on the IC is not upside down (see picture in the book where the position of the line, if you forget)
b. make sure all the sides and elbows straight IC on the printed lines in the PWB, and solder heat with steam, is approximately less than 2 cm from the IC, and adjust the temperature set aside some time to return the IC to cool.

6. Removing the plastic components
Components made of plastic is a combustible components and melt when exposed to heat. The use of steam is too hot solder will cause the plastic component is damaged. Adjust the heat to the soldering temperature steam 200UC â € "210UC with airflow 4 â €" 8, the arrangement usually does not cause plastic components to melt but it takes much longer than the removal or heating the IC. Direction of the solder vapor / ****er fixed on the components contained lead and tin are melted as soon as the plastic component is removed from the PCB, it will slightly melt the plastic on the surface but not a problem. After removal, note the wall in the edge connector should be carefully examined in the points that have metal contacts. Menyarap metal contact will heat up rapidly and melt lead. If it fails, then you must lower the temperature a little lower, this is due to differences in the solder used steam.

Sources: alergi.co.cc / By Muhammad Ihsan Zul

http://www.wahanaponsel.com/rajapons...C%20Ponsel.pdf

and Google Translate

I spent time to read and can just say thank you ..

[oysius]

thanks for the information but i found out the hard way about temperature i try to reheat an RF chip on blackberry at 400C and the phone never power on again. Now im afraid of RF chips. But 350C is good temperature and safe.

[garry_b]

for how long 350c how much time??

[oysius]

for me i use the tweezers until the component moves then i remove it

[mones pacu]

good master atas sharey