[medis]

@ ichal_spy

In theory ,You're absolutely right
But practically,today's parts are very good quality,and pcb place are too small to measure signals (or impossible).SEMC even SM are impossible to find.And phones will do not become HW broken without serious reason
In 99% chances of RF problems are mechanical pcb/parts damage (ceramical RX/TX switches,broken bga balls under RF and CPU interfaces...etc)
Sometimes,here are TX PA burn out.
But i remember 3310 phones,in TX 90% case -it were mechanical PA damage (with ceramic pad).In RX case -broken ceramic switch after fall.
I've repaired a lot.Just 1 phone from 10..20 were needed scope

So,good knowledge and experience may replace expensive equipment.
I don't saying,that i do not use scope


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