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Old 06-08-2009, 10:13   #49 (permalink)
gixxer_gixxer
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Join Date: Nov 2008
Location: UK
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The great xbox 360 reflow/reball debate!

OK guys, the problem we have here with these cheaper rework machines(i.e. jovy 7500) is the size of the bottom heater (i.e. about 160 X 160), in order to repair a large bga chip( gpu or cpu) on the xbox 360, you need a pre-heater that covers the full motherboard, what happens with these cheaper machines is that in the process because of the thickness of the pcb and material its made from and with a small pre heater, the board 'domes up' where centre of base heater is in relation the bga chip at 200 deg c plus(we need higher temp with unleaded), this causes very uneven contact on bga chip and if you get a successful reflow then its more luck than anything else, also the profile graphs I have seen on this forum for the jovy will never work for un-leaded reflow/ rework WHY? its simple the graphs show max temp at the probe of below 200 deg c, and at what temp does unleaded reflow? check your data sheets :-) , the only way you will get a result with these cheaper machines is to remove BGA chip, clean it up etc and then re-ball with leaded solder balls/paste with this we can use the profiles <200deg c possible, so in my eyes its up to jovy to provide larger pre-heater for unit. The jovy 7500 is a very good machine for the money don't get me wrong it can do a lot of good work on pcbs and is well supported, but I don't think its OK for xbox 360, can you prove me wrong?
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