Quote:
Originally Posted by Trion  My friends, am sorry i haven't posted here in a while. The heating method as i had shown here way back is a temporary fix. As Raheeeb said, its better to reflow the joints rather than just heating the parts as i was doing. This requires higher temperatures and the process is different. In some cases its even better to reball the CPU and GPU. Kits are now available on the net for doing this. The best solution would be to remove the ICs and reball them with leaded solder paste (yes i did say lead based solder and NOT ROHS solders that cause the problem). This along with improving the cooling as give on the Llama forums besides other forums will be a more lasting solution.
Please be warned that the methods mentioned in the post above this one on the You tube videos are temporary fixes too and mainly work by putting pressure on the balls. Then as the borad starts heating and warping the board starts giving problems again that get progressively worse. The you tube works only for short periods. |
even better than the llama forums ` go here after using sync and eject to get error code it will tell you which chips need reworking in its database
hope this helps
http://xbox-experts.com/errorcodes.php