| yes, expecially with multi module chip and lead free, all the graphics chips today are multi module chip, whit flip chip on it. Bga's are completly different thing, on the construction side.. for example, southbrige intel 82801 series are bga... nvidia gf6150 are multi chip module's. all the black plastic chips are bga... the green ones like nvidia and ati, but even intel northbridge are multi chips.
baking is not my conclusion, there are ipc standards that say that... j std- 033 and so on..
bga are less sensitive by moisture, multi chips are very sensitive to it... if you store the chip in a moistured enviroment the moisture will damage internally the chip during the soldering process. maybe the defect will be latent and will come out after many months. |