| no, no absolutely no! if you want to do reflow only, you have to see if you have done it correctly! you have done only a chip heat... if you want to do a reflow, you have to rework the chip , and you will have to check if the reflow is done properly. for doing so you will check with a tweezer if the chip become loose during the reflow process..
in other words you have to check if the solder balls will liquifiyng during the reflow, for doing that you must to tap the chip on the side, to see if the solder balls reached the liquifing zone.
but as i sayed , reflow is a waste of time, it does not add reliablity
there is no way to do so with an hot air gun, believe me or not... you need power, and at least you need a good infrared or hot air station. you need preheat, there is no chances to melt the unleaded solder balls with a simple hot air gun |