| Just to warn some people here as some of You havent got a clue about BGA and lead free.
You need at least 217C just to liquify leadfree balls.
To make reflow at least a bit reliable You need to keep the temperatue above 217C for at least 30sec with a top temp up to 230C. The whole profile needs to be properly adjusted, ramp, temp up and down, etc. This is extremely hard work and needs a lot of time and knowlegde/research. More than 230C peak temp can damage the chip pernamently. It also applies to lead solder and reballing.
To make repair completely reliabale You need a new chip from C2 or later family. Earlier versions of nvidias chip are simply badly designed and will brake sooner or later.
Best way to remove the red glue is heat gun or reballing. |