| Reballing with leaded is the ONLY way to go if you are not replacing the chip. A simple reflow is not effective and has high failure rate. If you have a Jovy, you can do it right. Don't cut corners or the product will be back on your bench in no time.
The main issue I have is that damn red epoxy that sometimes likes to permanently bond the chip to the board causing us to use higher temperatures to remove the BGA. I have destroyed too many chips or removed pads because of this problem. I try to remove as much of the epoxy as possible, but sometimes it gets under the chip where I cannot get to and it has a higher melting point than the solder.
Anyone got any suggestions other than dental picks and lots of patience? Maybe a chemical that dissolves the stuff. |