How to remove glue around BGA ICs on Nokia? - GSM-Forum

dimka · 06-18-2002, 01:58

I want to resolder CPU in 3310, but there's some glue around it.
How to remove it without damaging the IC?

Scaramouche · 06-18-2002, 07:46

Unfortunetly i dont know of any good way to do this.

With heat you can, but the amount of heat required to make the epoxy glass-like and fragile enough to splinter would destroy the rest of the pcb.

Chemically ive heard rumours of concentrated sulphuric acid been able to remove the epoxy, but i havent tried it and i dont intend to!!

That epoxy is a piece of ****, ive got a 8850 with a faulty MAD2 DSP which is underfilled.

genocite · 06-18-2002, 07:58

i've heard some info about this later.

Some friend of mine said that mercury could melted down the epoxy under bga ic's, but i never tried this and i should warned first, mercury is a very toxic and dangerous substance, it could evaporate easily and if inhaled could very dangerous to our health. So try this at your own risk

Good luck

vule · 07-15-2002, 04:35

Hiya

Put some flux over the chip and heat it from other side of board ( thru board )...It might help...

BUT!!!!!!!! Try this only if phone is already dead....U have nothing to loose...

BR

Vule

sat · 07-15-2002, 16:26

take some needle and insert it through glue underneath BGA. Heat it with airgun from all the sides and slightly move the needle upside. after removing BGA, clean the glue with pincette and airgun.

ooifk · 07-16-2002, 23:47

Yes, Sat

This is the common way to removed BGA IC with epoxy glue in China.
I noticed most of H/P repair man can handle very well during my last month visited China.

Just remove with Hot air ****er with out apply any glue removing chemical.

Is need some skill to do this and you may need to practice more........

Regards

Hanukkah · 07-17-2002, 00:59

Yes, agree.

But no amount of practice will assure you that no tracks will be removed from the board 100%

It's always a 50-50 deal regarding underfilled BGA ICs.

Tip is that your should ensure that the IC is heated on all sides.

Quang Thao · 07-17-2002, 01:54

Hi
I do it alots , only use hot air and blade to remove it. But only depend on your skill.You must practic more. I do it all day. Almost nokia 8250 hold is wrong in MCU so you must take it and re sold MCU.

May be IC will die but the board never damage because Nokia board verry good.

Don't try it with Samsung fone you will kill it.PCB of samsung fone not good and glue verry strong than glue on nokia fone.

Best regards

Scaramouche · 07-17-2002, 07:58

Very interesting, i must try this. How much heat do you apply? Should i set my hot air soldering iron on maximum?

Quang Thao · 07-17-2002, 21:06

Hi
about 200 degree and air strong . If use 850 chose hot = 5 and air = 5 but it is your experience. And dependence of your hot air.
You must test it. And have your experience I think I can't only talk it...
But not verry hot only the same when you use to sold or desold BGA.
best regards.

Jackmaxo · 07-18-2002, 04:21

Hi all,
It's a dangerous operation to do.
You can work for many hours and you will sucess only for few times. So change the BGA with glue arround only if your customer acept the risk to have a damaged phone.
but some times good luck is here

Regards

sat · 07-18-2002, 18:47

yes, customer should be warned first. sometimes PCB legs are torn. then you have nothing to do.
but mostly on Nokia's, about 90 %, changing processor is possible.

edoy · 07-21-2002, 19:59

quang thao;
i'm using digital hi-temp thermometer 5mm away from hot air's nozzle with the temp. of 200 degree celsius. and heated to glued bga but not succes on melting the balls . i think 200 deg. is not enough and how do you measure ur 850 hot air temp.

p.s.
i think the epoxy that used in the bga is the same as the one using for encapsulant for encapsulated smd ic as you have seen on some of the electronic watches.

there's a remover for that epoxy some of my freinds told me, i try to recall that name of the solution maybe i'll post it tomorrow.

06-18-2002, 01:58	#1 (permalink)
dimka Freak Poster Join Date: Nov 2001 Location: Omsk, Russia Age: 41 Posts: 121 Member: 7337 Status: Offline Thanks Meter: 0	How to remove glue around BGA ICs on Nokia? I want to resolder CPU in 3310, but there's some glue around it. How to remove it without damaging the IC?

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
How To Remove Glue From K610 Glue Pasted Chips	sairat	DreamBox	3	04-20-2008 16:57
how to remove glue on N80 /7390	MORRISGSM	MT-BOX	5	09-20-2007 20:48
How to remove glue arround components?	Futuro	Nokia Hardware & Hardware Repair	1	01-05-2005 15:52
how to remove glue under mutimodule on T68	SE-THAILAND	Sony Ericsson Hardware Repair	10	04-04-2003 04:48
How to remove glue under Ccont in 8210?	Trier	Nokia Hardware & Hardware Repair	12	11-02-2002 01:20

06-18-2002, 07:46	#2 (permalink)
Scaramouche Freak Poster Join Date: May 2002 Location: Perth, Western Australia Age: 45 Posts: 313 Member: 11937 Status: Offline Thanks Meter: 1	Unfortunetly i dont know of any good way to do this. With heat you can, but the amount of heat required to make the epoxy glass-like and fragile enough to splinter would destroy the rest of the pcb. Chemically ive heard rumours of concentrated sulphuric acid been able to remove the epoxy, but i havent tried it and i dont intend to!! That epoxy is a piece of ****, ive got a 8850 with a faulty MAD2 DSP which is underfilled.

06-18-2002, 07:58	#3 (permalink)
genocite No Life Poster Join Date: Jul 2001 Location: md Age: 25 Posts: 761 Member: 5379 Status: Offline Thanks Meter: 0	i've heard some info about this later. Some friend of mine said that mercury could melted down the epoxy under bga ic's, but i never tried this and i should warned first, mercury is a very toxic and dangerous substance, it could evaporate easily and if inhaled could very dangerous to our health. So try this at your own risk Good luck

07-15-2002, 04:35	#4 (permalink)
vule No Life Poster Join Date: Apr 2002 Location: Radiometer Medical ApSBrønshøj Age: 51 Posts: 721 Member: 10854 Status: Offline Sonork: 1578988 Thanks Meter: 3	Hiya Put some flux over the chip and heat it from other side of board ( thru board )...It might help... BUT!!!!!!!! Try this only if phone is already dead....U have nothing to loose... BR Vule

07-15-2002, 16:26	#5 (permalink)
sat Freak Poster Join Date: Aug 2001 Location: GSMLAND Posts: 479 Member: 5764 Status: Offline Thanks Meter: 2	take some needle and insert it through glue underneath BGA. Heat it with airgun from all the sides and slightly move the needle upside. after removing BGA, clean the glue with pincette and airgun.

07-16-2002, 23:47	#6 (permalink)
ooifk Freak Poster Join Date: Oct 2001 Location: Malaysia Posts: 108 Member: 6963 Status: Offline Thanks Meter: 1	Yes, Sat This is the common way to removed BGA IC with epoxy glue in China. I noticed most of H/P repair man can handle very well during my last month visited China. Just remove with Hot air ****er with out apply any glue removing chemical. Is need some skill to do this and you may need to practice more........ Regards

07-17-2002, 00:59	#7 (permalink)
Hanukkah No Life Poster Join Date: Jul 2001 Location: RP Age: 48 Posts: 890 Member: 5246 Status: Offline Thanks Meter: 9	Yes, agree. But no amount of practice will assure you that no tracks will be removed from the board 100% It's always a 50-50 deal regarding underfilled BGA ICs. Tip is that your should ensure that the IC is heated on all sides.

07-17-2002, 01:54	#8 (permalink)
Quang Thao No Life Poster Join Date: Jul 2001 Location: Viet Nam Age: 48 Posts: 544 Member: 5487 Status: Offline Thanks Meter: 5	Hi I do it alots , only use hot air and blade to remove it. But only depend on your skill.You must practic more. I do it all day. Almost nokia 8250 hold is wrong in MCU so you must take it and re sold MCU. May be IC will die but the board never damage because Nokia board verry good. Don't try it with Samsung fone you will kill it.PCB of samsung fone not good and glue verry strong than glue on nokia fone. Best regards

07-17-2002, 07:58	#9 (permalink)
Scaramouche Freak Poster Join Date: May 2002 Location: Perth, Western Australia Age: 45 Posts: 313 Member: 11937 Status: Offline Thanks Meter: 1	Very interesting, i must try this. How much heat do you apply? Should i set my hot air soldering iron on maximum?

07-17-2002, 21:06	#10 (permalink)
Quang Thao No Life Poster Join Date: Jul 2001 Location: Viet Nam Age: 48 Posts: 544 Member: 5487 Status: Offline Thanks Meter: 5	Hi about 200 degree and air strong . If use 850 chose hot = 5 and air = 5 but it is your experience. And dependence of your hot air. You must test it. And have your experience I think I can't only talk it... But not verry hot only the same when you use to sold or desold BGA. best regards.

07-18-2002, 04:21	#11 (permalink)
Jackmaxo Freak Poster Join Date: Dec 2001 Location: Earth Posts: 238 Member: 7934 Status: Offline Thanks Meter: 0	Hi all, It's a dangerous operation to do. You can work for many hours and you will sucess only for few times. So change the BGA with glue arround only if your customer acept the risk to have a damaged phone. but some times good luck is here Regards

07-18-2002, 18:47	#12 (permalink)
sat Freak Poster Join Date: Aug 2001 Location: GSMLAND Posts: 479 Member: 5764 Status: Offline Thanks Meter: 2	yes, customer should be warned first. sometimes PCB legs are torn. then you have nothing to do. but mostly on Nokia's, about 90 %, changing processor is possible.

07-21-2002, 19:59	#13 (permalink)
edoy Insane Poster Join Date: Mar 2002 Location: Computer Hospital Age: 47 Posts: 82 Member: 9828 Status: Offline Thanks Meter: 2	quang thao; i'm using digital hi-temp thermometer 5mm away from hot air's nozzle with the temp. of 200 degree celsius. and heated to glued bga but not succes on melting the balls . i think 200 deg. is not enough and how do you measure ur 850 hot air temp. p.s. i think the epoxy that used in the bga is the same as the one using for encapsulant for encapsulated smd ic as you have seen on some of the electronic watches. there's a remover for that epoxy some of my freinds told me, i try to recall that name of the solution maybe i'll post it tomorrow.