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Go Back   GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > Nokia > Nokia Hardware & Hardware Repair


Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section.

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Old 11-04-2002, 06:42   #1 (permalink)
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PCB Test Points, Win Tesla, Pheanix, BGA Rework...


PCB Test Points, Win Tesla, Pheanix, BGA Rework...

Mr Willy,

1. Is it possible to measure PCB Test points without Osciloscope...?
2. Is it possible to power up the phone (3310, 8210) without HAGAR..?
3. How to use wintesla & Pheanix with or without dongle..?
4. How to make Soldering Bals Under BGA, HAGAR chip's..?
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Old 11-04-2002, 16:54   #2 (permalink)
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Re: PCB Test Points, Win Tesla, Pheanix, BGA Rework...

iqballk

>>> 1. Is it possible to measure PCB Test points without Oscilloscope...?

if you only test voltage, multi test is enough !, but if you have to " see" that wave, then you real need oscilloscope !


>>> 2. Is it possible to power up the phone (3310, 8210) without HAGAR..?

yes, you can try to make a wire jump , direct give 26Mhz to BB , but i do not thing, this is good idea !

>>> 3. How to use wintesla & Pheanix with or without dongle..?

with PKD-1 dongle, you just plug it in print port and install wintesla and phoenix, and also install all DLL !

without PKD-1 Dongle, ........ DO NOT ASK ME , PLEASE !

>>> 4. How to make Soldering Bals Under BGA, HAGAR chip's..?

balls ?
i use 0.5mm BGA ball , not tin paste !
and use reball kit !

Willy
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Old 11-05-2002, 01:16   #3 (permalink)
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I WANT PICTURE FOR THAT PLZ

"""2. Is it possible to power up the phone (3310, 8210) without HAGAR..?

yes, you can try to make a wire jump , direct give 26Mhz to BB , but i do not thing, this is good idea !"""



THNX FOR UR HELP
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Old 11-05-2002, 01:44   #4 (permalink)
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Wire pin 3 of 26 Mhz crystal to c559 (for 33xx) c829 (for 82xx).
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Old 11-05-2002, 10:02   #5 (permalink)
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About reballing....u clean very good the processor then insert balls in every hole? u r using some paste to keep balls firmly...pls explain me in details the process...thank u
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Old 11-05-2002, 13:38   #6 (permalink)
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Willy,

I have a 852 Hot Air.
What's these balls, 0.5mm BGA ball , tin paste !

I Have Goot Soldering Paste from Japan.
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Old 11-05-2002, 14:06   #7 (permalink)
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Melsoft,

no, i do not use that "tin paste" , it is becasue after reball by tin paste, it not same size for each ball, and use tin ball much easy to do reball job by insert balls to eash hole , of cause, i will put some flux to chips BGA face !

Willy

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Originally posted by melsoft
About reballing....u clean very good the processor then insert balls in every hole? u r using some paste to keep balls firmly...pls explain me in details the process...thank u
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