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RE-7500 Reworking System & iSolder the Infrared Reworking System - Product By Jovy Systems. & iSolder the intelligent soldering machine |
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![]() | #91 (permalink) |
Junior Member Join Date: Nov 2010
Posts: 2
Member: 1449143 Status: Offline Thanks Meter: 0 | Are some pads dummy pads? I have noticed some pads don't connect to anything. I tried buying some epoxy remover from Ebay but it didn't work at all. I experimented with paint thinner this weekend and it melts the epoxy in about 15 minutes but I have to recoat the epoxy with paint thinner about 3 times. some bga's have the epoxy way under the chip and they are hard to remove causing more lifted pads. How to fix these pads? anyone? |
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![]() | #92 (permalink) | |
Crazy Poster ![]() ![]() ![]() Join Date: Mar 2007
Posts: 59
Member: 473301 Status: Offline Thanks Meter: 11 | Quote:
there will be some are dummy pads on the board, epoxy glue removal is useless, i have posted glue removal video on the forum download and check if it helps you B/R Pentu | |
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![]() | #93 (permalink) |
Junior Member ![]() Join Date: Nov 2010 Location: Denmark
Posts: 17
Member: 1451453 Status: Offline Thanks Meter: 4 | Hello, Actually I have both reball station and direct heat stencils, I prefer direct heat stencils and hot air for reballing (100% success every time), removing is easy, I use a ultrasonic cleaner, with isopropyl alchohol. After 1-2 min it's very easy to remove the stencil. |
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![]() | #94 (permalink) |
Junior Member Join Date: Nov 2010
Posts: 2
Member: 1449143 Status: Offline Thanks Meter: 0 | I use direct heat stencil as well but I just heat up the stencil a little to remove the screen or remove it while the stencil is still hot. Maybe 30 seconds after you're done reballing, the balls should be solid and you should be able to remove the stencil. Does anyone have instructions on fixing the pads? |
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![]() | #95 (permalink) |
No Life Poster ![]() ![]() ![]() ![]() ![]() ![]() Join Date: Oct 2001 Location: -------- Age: 56
Posts: 1,009
Member: 7062 Status: Offline Thanks Meter: 126 | To remove the direct heat stencil , you should be sure that all balls melted with pads. Then, using Flux remover is the best not anyother solvent might effect the package surface. Direct heat stencil has a life time of 6 to 10 times. Before, getting deformed. It is consumed by use. For stencil Life time, you should not be hurry and use your tools with enough height - tool might vary between IR,Hotair or heat gun. Have Fun ![]() |
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![]() | #96 (permalink) | |
Junior Member ![]() Join Date: Dec 2006
Posts: 15
Member: 413017 Status: Offline Thanks Meter: 1 | Quote:
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![]() | #97 (permalink) |
Junior Member ![]() Join Date: Dec 2010
Posts: 15
Member: 1461747 Status: Offline Thanks Meter: 0 | Hey, great threat here. I also repair laptops and i have a repair system from martin (hot air and infrared). But often the repaired laptops come back after a one or two months. I think i have a cleaning problem. But also i hear from a professional repair company that the gpu often is internal faulty, and this is not fixable. Now i want to try brand new gpu's, but i don't find anything. Did anyone know where i can byu gpu's they don't have this problem? Greetings Nicpoe |
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![]() | #99 (permalink) |
Junior Member ![]() Join Date: Dec 2010
Posts: 15
Member: 1461747 Status: Offline Thanks Meter: 0 | I have at the moment 5 brand new gpu's from china. They are manufactured in Korea, the other ones in Taiwan. Which type or label has the new gpu's? I repair Laptops with GF-7200, 7400, 7600 and G84/G86 GPU's in Germany. |
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![]() | #101 (permalink) |
Junior Member Join Date: Dec 2010
Posts: 3
Member: 1463540 Status: Offline Thanks Meter: 0 | BGA Removal Anybody else having trouble removing some BGA chips. I seem to come across some BGA's; even without the epoxy around them, that just don't seem to want to come off the board even at 240 degrees. As a test i had the temp of the top IR heater at 240 Degrees and the bottom heater at 350 degrees for over a minute and a half and the chip would not budge. Any ideas on why some chips seem to be fixed solid to the board while others flow easily once temp reaches 217 degrees. |
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![]() | #102 (permalink) |
Freak Poster ![]() ![]() ![]() ![]() Join Date: Jan 2007
Posts: 210
Member: 437621 Status: Offline Thanks Meter: 19 | koko224 - try bringing the board temp to about 160C before appling the upper heat. Make sure that plenty of flux is under the chip. It should come off as soon as you hit 218C. If you have difficulty getting board to 160C with just the lower heater you will have to lower the fixture or raise the Jovy unit. |
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![]() | #103 (permalink) |
Junior Member Join Date: Dec 2010
Posts: 3
Member: 1463540 Status: Offline Thanks Meter: 0 | BGA Removal Hi Dan, Thanks for the advise. However, I can't have the machine any higher than it already is. I just thought it's a bit strange how the majority of BGA's will flow fine once 217 degrees is reached, but then every now and then the exact same chip on a different board won't move at all. I was thinking maybe there was a different kind of alloy being used on these chips that need much higher temperatures, but not sure. |
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![]() | #104 (permalink) |
Junior Member Join Date: May 2001
Posts: 14
Member: 4800 Status: Offline Thanks Meter: 2 | Hi to all. I have an T862++ and i'm having some problems. Do i need to reach 160ºC on bottom of the board or on top (gpu)? On the upside i only can reach +/- 90ºC. Until now i only could lift one gpu correcly... i already killed 3 dv6000 boards. Regards, R |
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![]() | #105 (permalink) |
Junior Member Join Date: Dec 2010
Posts: 1
Member: 1462058 Status: Offline Thanks Meter: 0 | Roadkiler ... I have an T862 and up to know the temperatur on surface of the board is also +/- 90°C . But I am able to remove the chips. It could be that some parameters from your t862++ are not ok. Which parameters do you use for IR Heat Lamp? Which lens do you use (28mm 38mm 48mm)? What distance between Ir Heat Lamp and board do you use? With the following parameters I have successfull removed the chips from DV6000 board. Nvidia NF-SPP-100-N-A2 BGA size:25x25mm Preheater: 200°C Distance between IR Lamp and board:45mm Lens: no IR Heat Lamp Temp:270°C Time to remove chip:120s Flux:yes Nvidia GF-GO7200-B-N-A3 BGA size:33x33mm Preheater: 200°C Distance between IR Lamp and board:45mm Lens: no IR Heat Lamp Temp:270°C Time to remove chip:120-150s Flux:yes You could use those data and try them with your t862++. BR ThomasP |
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