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Android based Phones / Tablets For all of your questions relating to the android mobile phones.

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Old 11-27-2018, 13:58   #1 (permalink)
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# emmc basic knowledge from micromedia sttsi


All of mobile phones need Storage to store the main firmware or operating system, in android phones density of storage need to be larger than before, mobile phone manufacture need to use NAND based FLASH memory, the newest technology to the NAND based FLASH memory that use in mobile phones is UFS ( universal flash storage ) we will talk about UFS later, now we will talk about technology before UFS, yes... we will talk about storage named eMMC :

embadded MULTI MEDIA CARD or embadded NAND is a NAND BASED FLASH MEMORY CHIP + CONTROLER, the controler contains MCU and internal LDO, that make the communication between NAND and the HOST more fast, use 8 PIN of DATA, 1 PIN of CMD and 1 PIN of CLK.

this eMMC need two supplies, one is VCC ( VDDF ) and the another supplies is VCCQ ( VDD ) as positive supplies chain, and VSS will conected to the system GND just like ussual, we arent need to supply anything to the PIN named VDDI ( this PIN are used to access bank capasitor for the internal LDO only )

there are another PIN named RST, this pin use for executing the hardware reset function and fully controlled by the host.

many packages for eMMC products tha avaliable on the mobile phone market, at lease we found 7 packages that used in many many of mobile phones :

1. FBGA 153 ( used as eMMC and eMCP products )
2. FBGA 169 ( used as eMMC and eMCP products )
3. FBGA 162 ( used as eMCP products )
4. FBGA 186 ( used as eMCP products )
5. FBGA 221 ( used as eMCP products )
6. FBGA 529 ( used as eMCP products )
7. FBGA 254 ( used as eMCP products )

eMCP is MULTI CHIP PACKAGE based eMMC, means in one IC have two hardware that not related each other ( so its called MULTI CHIP ) one is eMMC hardware and the other is RAM hardware

if you found eMMC 153 / 169 package, you must see the label name to know what ic is it ( eMMC only or eMCP ) for examples if you found 153 / 169 chip from samsung you can see the label if it "KL" ( this is eMMC only ) and if it "KM" ( this is eMCP )

For SKhynix it is H2 and H9 and for Sandisk it is DU and DP, its ok... i will tell you about it in the another sesion, now we are back to the topic.. So.. eMMC / eMCP in package FBGA 153 and 169 is possible, you just need to know how to read the label name on the package, the good news is both of eMMC dan eMCP is still have a eMCP hardware inside it, and offcourse have a eMMC PIN that wa alread discuss before, the pin map for FBGA 153 and 169 is totally same for the MAIN PIN, the different between them : 169 have 16 GND PIN more in the right and left side, you can see the picture below

the pin mapping will be like this ( top view ) :

eMMC that use package FBGA 153 / 169, have so many PIN that DO NOT USED ( DNU ) or NOT CONNECTED ( NC ) because only eMMC pin that used in this IC, you know about this eMMC PIN, DAT 0, DAT1, DAT2, DAT3, DAT4, DAT5, DAT6, DAT7, CMD, CLK, VCC, VCCQ, GND, RST, VDDI. and the other is NC / DNU.

eMCP that use package FBGA 153 / 169, have less PIN that DNU or NC, becouse besides eMMC PIN there is RAM PIN, you can see to the picture the RAM PIN, they have another VCC and VCCQ for RAM, they HAVE 32 PIN for DATA ( IO ) and many other, this is why in the eMCP we will found less PIN that NC / DNU.

Please becarefull when you faced phone that should be have 16 GB ROM and when you open it you found that phone use 153 / 169 package, make sure this phone need eMMC only or need eMCP, IF IT NEED eMCP !! :

1. you can not let any of eMMC PIN and RAM PIN broken, please make sure all eMMC PIN and RAM PIN still ok in the phone PCB and please USE eMCP IC's only for replacing
2. you cant USE eMMC models for this phone, i mean you cant USE KLMAG2GE2A-A001, KLMAG2WEMB-B031, KLMAG2GE4A-A001, KLMAG4FE4B-B002, KLMAG4FEAB-B002, KLMAG4FEAB-A002 .... yes i know thoose eMMC is 16 GB ROM but they doesnt have RAM inside it, so in this case you need to use eMCP such as KMVTU000LM-B503, KMVYL000LM-B503, KMV2W000LM-B506, KMV3U000LM-B304, KMV3W000LM-B310 thoose ic have 16 GB of ROM and 1 GB LPDDR1 of RAM. ( for 153 / 169 package if it is eMCP the RAM inside it is always LPDDR1 technology )

If you found some phone only need eMMC in that spot ( some phone use another IC as RAM ) so you have no problem, you can use eMMC ic or eMCP, both of this IC have eMMC inside it, you only need to pay attantion to the ROM density that needed by the phones, and offcourse ic dimension.
just for note : sometime you need to noted that EXT_CSD rev 1.6 eMMC can not be use in to phone that instaled android 5.0 and above.

see you in the next sesion

Yongky felaz

micromedia STTSI - indonesia
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Old 11-27-2018, 14:03   #2 (permalink)
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from the previous post,
when we faced some phone that use eMMC package FBGA 153 / 169, we need to make sure that spot only for eMMC or need RAM also, how to do this ?

There are two simple methode :

1. visual check
we can read label name on the package of IC, and googling it, search as many as possible information, that make you sure this one is eMMC only or this one also have RAM inside it, that we called eMCP.

offcourse if it from samsung IC's, its easy :

- if it KL it was eMMC only
- if it KM it was eMMC + RAM ( known as eMCP )

2. pin resistance check
after ic removal, we will found BGA pads on the PCB, you already know which one is eMMC PIN and which one is RAM PIN based on PIN MAP that i posted before
now all you need to do is check some of RAM PIN on the PCB, if you didnt get the resistance value of it, so that pin might be NC / DNU, so this phone PCB only need eMMC, this is why RAM PIN is not used in this PCB ( this is not weird things, some phone use another IC as RAM, standalone RAM, POP RAM above the CPU, etc )

we can do measurement check to the bga pin in the PCB, just do simple resistance check use ohm meter, just put your red probe to the RAM PIN pad you wanna measure and put the black probe to any system ground of PCB.

from the picture bellow you can vissualy found that some of RAM PIN PAD have a surface layer circuit in the PCB, actualy we dont need to measure when we can see RAM PIN have a circuit on the surface like this, we can assume that RAM PIN is USE by PHONE PCB, and select eMCP for replacement.
if you are not sure enaugh, just remember you always always always can do the resistance check on thoose PIN.

Some of phone use eMMC and some of phone use eMCP, its ordinary things,
if that phone need to use eMMC only, the manufacture will put FBGA 153 / 169 eMMC, because there is no another package avaliable for eMMC only ( all of 162/186, 221, 529, 254 must be eMCP )

if some phone designed want to use eMMC + RAM LPDDR 1, package 153 / 169 is avaliable

if some phone designed want to use eMMC + RAM LPDDR 2, their PCB designer have a choose to select any eMCP in 162 / 186 package, because this kind of package is avaliable for LPDDR 2 eMCP technology.

if some phone designed want to use eMMC + RAM LPDDR3, their PCB designer can choose eMCP in 221 package, because this package known as eMCP that their RAM use LPDDR 3 technology

if some phone designed want to use eMMC + RAM LPDDR4, their PCB designer need to choose eMCP in 254 package.

as mobile phone engineers, offcourse we will found some phone use 153/169, another one use 162 / 186. another one use 221 or 529, and another one use 254, you no need to said WOW from now on

the eMMC blocks and RAM blocks is totaly sparate, and have their own connection, have thair own supplies, etc... and not related each other.

thankyou for visiting
see you in the next sesion,

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Old 11-27-2018, 14:16   #3 (permalink)
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we are in a sesion 3 now, we already understand basic things about eMMC and eMCP, i will make another threads that will discuss about spesific RAM in the eMCP and all of symptomp that would be show up because RAM problem.

now we will going back to the topics, yea it was "eMMC things"

all of thoose eMMC and eMCP have a eMMC blocks anyway
inside eMMC there is controller and NAND, trough this controller whole of NAND can be accessed by the HOST.

in the phone PCB our PHONE PROCESSOR are the HOST, all of processor have a right to access the eMMC trough controller.

huh, what do you mean about all of processor ?
there are application processor part, there are baseband processor part
it was not new things.. if you remember some of NOKIA BB5 PHONES, have a RAP3G ( works as baseband processor / CMT / modem ) and OMAP ( works as application processor or APE part ) the same things is still happen now, some processor chip build BASEBAND PROCESSOR and APE PROCESSOR in a single chip, many of MEDIATEK PROCESSOR have structure like this.

MT65xx : APP processor + BASEBAND processor that supported 2G and 3G
MT67xx : APP processor + BASEBAND processor that supported 2G, 3G and 4G

so many MTK processor it was build in APP and BB processor, you will not found two processor chip inside Phone PCB.

the samething will found in QUALCOMM based phones, if that phone use QUALCOMM processor "MSM" products ( Mobile station modem ) processor, this kind of CHIP have APP processor and BB processor inside of it.

if we found some phone use Exynoz processor or intel atom processor, they doesnt have BASEBAND inside that processor chip, so... manufacture need to put another processor as BB processor... so... shanon, infineon or qualcomm "MDM" processor ussualy choosen to works as BASEBAND procsessor.

i would love to start sesion about thoose processor things for sure, maybe i need to create another threads for it, now we need to go back to our primary discussion : "all of processor on our phone can access to the NAND trough the controller" yes, as the host, processor can send command, and read, erase, or write to NAND area trough eMMC controller.

eMMC controler is easy to communicate, only need two supplies of VCC and VCCQ, VSS ( GND ), and CLK, CMD, the HOST can access NAND use 8 bit data ways ( dat0 - dat7 )

the HOST need to have NAND access to RUN the mobile phones hardware, to run basaeband / modem part and app part, all of operating system that store inside the NAND

for example :

mbr / gpt
boot image
splash screen
user data

all oF NAND inside the eMMC, have a 4 basic partition :


manufacture have a right to put their bootloader to any of partition, actually the manufacture will follow the typical of based processor / platform, for example if it use MTK processor, so manufacture need to know that MTK processor wil works when bootloader is in BOOT1 PARTITON, so the preloader file that operated as BOOTLOADER in MTK PHONE need to be write on BOOT 1 PARTITION as well, and write another to USER AREA partition.

"each platform have their own methode, you need to know little bit of it, some of it similiar, some of it have a special need, its ok no need to worry, all of your box for emmc programing will help you to prepare emmc for each target phone platform, specially if you have ext_csd for that phones ( this is why we need works togather to make some huge database of dump + ext_CSD collection of phone you might be found for repair )

WHy we need to have ANY OF EMMC BOX TOOLS ? ------------------------------------------------

all of thats box will act just like our phone processor as HOST, will become external HOST, inside syscobox have a ARM processor, and from thats IO, we build communcation to the eMMC CMD, DATA0 - DATA7, CLK.

inside of it need to have LDO, and will supply VCC and VCCQ for our target eMMC.

any of emmc box tool will access eMMC just like your phone processor access it. the good things is we can deploy any command we are need, our programmer use speccial command to the eMMC controler to acces registry on eMMC controler, this is why any emmc box.. not only can READ, WRITE, or ERASE to our NAND... your emmc box tool need to totally identify, can accessing OCR, CID, CSD, EXT_CSD, can ask smart report, etc.. from eMMC that connected to our emmc box tool

make sure your emmc box tool can do modification on CID for change PNM ( productname ) MID, MDT, etc... also can do eMMC controller flash programming, that known as FFU.. it will make our target eMMC back to the default state, just like new eMMC.

we can do this operation use any emmc box as external host, this kind of operation procedure its called eMMC direct programming.


when your phone NAND can not be programmed ( partial / full ) use any software that use USB connection.

normal phone can be programmed use USB methode, use many software, some of them can be programmed under FASTBOOT methode, some of them can be programmed under SOC methode.... yes it was correct procedure... and if your phone have no problem with their eMMC, you will found everthings works fine.... but, iam not talking about phone that still can be programmed use USB, iam not talking about phone that still have full normal eMMC inside of it... iam talking about phone that might be have a problem with their emmc, iam talking about phone that cant be done use regular USB software.

in this condition you always still have option to do direct eMMC programming, for repairing the old eMMC purpose or for prepare the replacement eMMC for that phone.

so you need to have some products to do this direct eMMC programming methode, isnt ? the most importand things for me is many people know about emmc and emmc direct programming methode.


Yongky felaz
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Old 04-02-2020, 19:05   #4 (permalink)
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hello friends,
after you read my thread about # eMMC Basic Knowledge # i believe all of us understand that flash memory ic on major android mobile phones use eMMC and eMCP right now.

we already discuss about all packages of eMMC and eMCP that oftenly used by the mobile phone manufacturer, and i hope we understand the difference between eMMC and eMCP is a the exixtence of RAM hardware inside of it... whatever the difference of all those package, they have an equality anyway..yes, all of it must have a eMMC inside

in the # eMMC Basic Knowledge # thread we also discuss about what condition that makes us need to do eMMC direct programming, i dont wanna repeat what i wrote on previous thread, you can read it there my friends, now i will continue the discussion about eMMC direct programming procedure, what we exactly need to do

Direct EMMC is a procedure of communication with the eMMC
directly. Execution with this procedure is the most complete and
most thorough, compared with the activity execution using
USB or JTAG procedure, because it can execute all the parts of the
eMMC, either filling every partition in the NAND/storage as well
as part controller, such as, accessing the register even the firmware
of the eMMC itself.

The standart procedure of direct eMMC method :
1. Identification to analyze the feasibility of the eMMC
2. Do read ( backup ) the partial / whole partition, if necessary
3. Do a emmc repair step if found any discrepancy on it
4. Do the appropriate configuration for the target device
5. Do write correct dump file for the target device
6. Do a final check to make sure the eMMC is ready to reused

The above procedure does not need to be done sort appropriate
numbering, the most important is the need to know the function
of each procedure, so as to understand when is the right time to
do and how to do such a procedure using any of emmc tools

1. Identification the eMMC

This process is the first step in any execution eMMC, which in this
step will be invalidated, the status and condition of the eMMC is
being executed, and it helps to take a step for proper execution
that required in that eMMC repairing / preparation

When you take off old eMMC ic from your phone, and you wanna try to identify it, you will find the possibility of that eMMC fail identified by syscobox, it is possible.. referring to the eMMC conditions may vary, when eMMC cant boot properly, it can be in weak condition or needs special behavior and so forth ( do not forget it was from broken mobile phone that cant be solved by regular usb methode flashing procedure, isnt ? )

syscobox provides the option to set the interfacing condition in Manual ( auto is default ) includes, the setting of :

1. Voltage of VCC and VCCQ that you wanna supply to eMMC
2. Communication speed (clock) to the each bus
3. Bus width that is used to communicate (1 bit/4 bit/8 bit)
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Old 04-02-2020, 19:14   #5 (permalink)
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1. you can use ISP methode use eMMC ISP adapter

When we connect to the eMMC through the ISP procedure, make
sure to give a "check" to the direct eMMC (ISP) options, and then emmc box will automaticaly apply setting that ussualy successed to boot eMMC in this procedure, but you always have possiblilty to change the setting that you wanna apply to boot the eMMC, including the VCC and VCCQ, clock speed and bus width that you wanna use as well

2. you can put off you eMMC ic form your mobile phone PCB, and put that ic in eMMC socket, you can use all other eMMC socket that have correct pinout with the box, on the market for doing this

it was the best connection that we could have, just put your eMMC to the socket, if you use the old eMMC from broken phone, maybe you still need perform setting that we already talking about, if you put new eMMC as replacement ic for the target mobile phones, please notice that you no need perform any special setting, thats replacement ic must have a normal condition, and should success boot in a normal condition or default setting of OCR ( operation condition register )

if it not ? why you still wanna use that ic as replacement ic for your mobile phone ? take another one bro..
so we are done talking about connection setting, we will continue to talking about information that we get from identify process.


1. Select devices and Check connection :
This function will allow you to select to use syscobox as interface or use sd card reader for raw access methode, and then you can check connection between emmc box software and selected devices, all of supplies, clock, and IO ready to communicated or not

2. Configure connection :
This function will allow you to change :
- VCC value ( 2,8 volt - 3,3 volt )
- VCCQ value ( 1,8 volt - 3,3 volt )
- Clock / speed ( 1 Mhz - 52 Mhz )
- Bus width ( 1 / 4 / 8 ) interface
you can leave it default anyway or thick to the "ISP" profile if you make communicate to eMMC trough ISP methode

3. Identify target :
This function will start access to the eMMC, the sysco will acces the eMMC controler block and read the eMMC controler registry, such as :


from this registry any emmc box will get information of eMMC, including the manufacturer ID ( Samsung, SKhynix, Sandisk, Toshiba, Kingston, etc )
the product name ( KJS00M, NJS00M, VTU00M, V2W00M, K8U00M, etc ) the serial number, the manufacture date, the eMMC firmware rev, the emmc version from ext_csd revision, the partition size of boot1 - boot2 - rpmb - user area, partiton configuration, status repartition, status write protect, etc.
any emmc box also show information of android / OS ROM inside it ( if content not blank )

4. eMMC general procedure
any emmc box can access eMMC directly as binnary access, we can READ, WRITE ( binnary FILE, known as DUMP FILE ) or ERASE to the spesific partition :

- BOOT 1
- BOOT 2
- RPMB ( no need to access for now )

we can also backup or write the value of EXT_CSD to change partition configuration, resize partition, make enhanced GP to the USER AREA partition here

5. manualy execute configuration
any emmc box will allow you to change / modifiy partition configuration, including which partition enable for boot, boot acknowledge sent or not during boot procedure
you can also change the size of boot and rpmb partition here, any emmc obox will change your eMMC partition size as you wish ( not all of eMMC models supported )

6. Write CID and Restore CID
When we replace eMMC IC to the MTK based phones, we need to check the list of eMMC supported in the preloader file of the target phones, we will faced the condition that we dont have any eMMC in the list, all you need to do is :

- make sure the replacement IC have same spesification
- choose eMMC / eMCP from samsung semiconductor
- do the ussual procedure to prepare and write eMMC
- do not forget to change eMMC product name to the one of eMMC name in the list of preloader, use write CID procedure ( Product name is a part inside CID )

and if something goes wrong, you can restore it to the original product name use the button of it

7. eMMC Testpoint ( #RE TP forced boot mode ) for dead eMMC
collection of picture that show te pin #TP position on the emmc
i will put in the next post

8. Disable permanent WRITE PROTECT
WRITE PROTECT is a eMMC features that make your eMMC only can read and cant be write, in this case the phones will be looks freeze, if we USB flash programming to the phone, it would not change anythings, when we do wipe, erase,.... the phone will still in previous state, even if the phone use custom wallpaper it will remain there.

normally we are give up use a USB flash procedure and decided to use eMMC direct programming, after identify syscobox will show you the eMMC WP features is active or not, if it active we can use this button to make the WP features disabled.

Note : WP status activated when your eMMC NAND block has a problems, maybe some bad blocks, maybe some communication distract, you must realize that your eMMC condition maybe isnt health enaugh, if the phones have some problems in the near future you need to replace the eMMC IC.

9. Nand TEST
this feature allow you to make some test to the random NAND sector, any emmc box will write on it and verified it, please feel free to make few of NAND test clicking and clicking, make sure our eMMC is health enaugh.

10. Update eMMC firmware
this feature will write eMMC controler firmware, will make your eMMC to the default state, all logs will cleared, all register will restored to the original one, it will make your eMMC just like a new eMMC state
Note : not all of eMMC supported for this features

11. Factory erase & Factory reset
this features will clean up your NAND area just like new, clear and wipe all content inside of all partition, just like FLUSH it use "0"

12. Health report & smart report
this features will reporting the emmc status, emmc erased counter, how many bad blocks, ECC report,......


when you click the identify button on software GUI, you will get The infromation from connected eMMC, this information from eMMC controller register, such as OCR, CID, CSD and EXT_CSD :

box device information :
Check device connection... OK
Check Device... Done
Identify device target... OK

eMMC operation condition information
Setting device operation...
Vcc: 3.3 V, Vccq: 3.0 V
Clock frequency is 24 MHz
Connect Bus Width in 8 bit
BGA connection... Ready

eMMC CID ( card identity data ) information :
Manufacturer ID: 0x15 (Samsung)
Product name: VTU00M (56545530304D), rev: 0xF7
Serial number: 0x37C120B0
Manufacturing date: Jan 2014
CID: 15010056545530304DF737C120B01168
explaination :
from CID you will get 32 bit hexadecimal character
15010056545530304DF737C120B01168, if we make some bit slice to it, we will get :

15 : MID / manufacture id ( samsung : 15, sandisk : 45, skHynix : 90, etc )
0100 : sparebit / not specific use for now
56545530304D : PNM / product name ( 565445530304D : VTU00M )
F7 : REV / firmware version or revision of controller inside the eMMC
37C120B0 : SN / serial numberof eMMC that connected
11 : MDT / manufacturing date ( 1 : january, 1 : 2014 in the table of MDT )
68 : checksum

CSD ( card spesific data ) information :
CSD: D02701320F5903FFF6DBFFFF8E40406C
CSD register content, i will explain in the next sesion, after all of basic things alread explained

EXT_CSD ( extended card spesicfic data ) information :
EXT_CSD revision: MMC VERSION 4.5
Partition Info:
Boot1: 2,048 KB
Boot2: 2,048 KB
RPMB: 128 KB
User Area: 14.68 GB (15,028 MB)
GP Partitions: None
Hardware reset function: 0
Partition configuration:
Boot acknowledge is sent during the boot operation
Device is not boot - enabled(default)
Partition support:
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot bus conditions: 0x00
Bus width: x1 (sdr) or x4 (ddr)(default)
Boot mode: sdr(default)
Reset bus width to x1 sdr(default)
Boot area write protection: 0x00
User area write protection: 0x50
Cache size: 0 MB

Explaination :

information configuration inside eMMC that connected, it will inform you about size / density of each partiton inside, as we know, there are 4 default partition inside emmc, boot1, boot2, rpmb and user area. we can get detail size information from this logs, also we can get information of GP ( general purpose partition ) if it already created in user area partition. GP is a enhanced partition that need to create when you prepare eMMC for intel platform mobile phone, such as asus zenfone 4, 5, 6, 2 or lenovo K900, until now GP not needed by other platform, so defaultly GP must be not existing ( none ) when you identify eMMC.

partition configuration information that apply in that eMMC, such as partition to take a boot file for booting procedure, enable / disable option of send boot acknowledge during boot procedure, etc. we need to perform this configuration refer to mobile phone target requirement, some of mobile phone platform need boot 1 enable for boot and boot ack send during boot procedure, some other platform need boot 1 enable for boot, boot ack not send during boot procedure, theris 8 condition that we can set to this configuration refer to mobile phone target requirement.

and information condition of another configuration inside EXT_CSD, such as device already partitioning or not, device wp feature are active or not, etc.

Nand content information :
Read user partition... eMMC BLANK

Check eMMC contents... BLANK no OS
Get Android OS details... BLANK not Have
this information will explore nand content inside eMMC,
is it blank or have content inside nand, ofcourse it will show BLANK if you identify new eMMC or empty eMMC.

Label type that match to the PNM ( product name )
Target selected: Samsung KMVTU000LM-B503

it will select automaticaly label type of ic, this
will show information from syscobox database, what ic is it, the spesification of that ic will be informed, it is eMCP if it have RAM inside
and it will be use to automaticaly select the correct firmware for FFU procedure, when you perform update eMMC firmware.


i think we are completed the sesion 1 of the eMMC direct programming
we already explain the basic knowledge of it, i hope you enjoy to learn eMMC with micromedia STTSI indonesia

i will explain about :

2. Do read ( backup ) the partial / whole partition, if necessary
3. Do a emmc repair step if found any discrepancy on it
4. Do the appropriate configuration for the target device
5. Do write correct dump file for the target device
6. Do a final check to make sure the eMMC is ready to reused

in the next sesion in this thread, please stay with us...


im sorry if i do any mistake, CMIIW

yongky felaz

Last edited by micro_media; 04-02-2020 at 19:22.
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Old 04-08-2020, 11:18   #6 (permalink)
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Old 11-18-2020, 11:13   #7 (permalink)
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Old 12-01-2020, 10:27   #8 (permalink)
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thank u
very informative
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