|
|
 |
|
Welcome to the GSM-Forum forums. You are currently viewing our boards as a guest which gives you limited access to view most discussions and access our other features. Only registered members may post questions, contact other members or search our database of over 8 million posts. Registration is fast, simple and absolutely free so please - Click to REGISTER! If you have any problems with the registration process or your account login, please contact contact us . |
| |||||||
| Register | FAQ | Donate | Forum Rules | Root any Device | ★iPhone Unlock★ | ★ Direct Codes ★ | Direct Unlock Source | Today's Posts | Search |
| iPhone, iPad, iPod Hardware Repair Hardware Repair discussions for iPhone, iPod , iPad & Apple Products, help, guides. |
 |
| | LinkBack | Thread Tools | Display Modes |
03-17-2013, 18:21
| #1 (permalink) |
| No Life Poster  Join Date: Mar 2007 Age: 39
Posts: 681
Member: 475448 Status: Offline Thanks Meter: 60 | 3gs reball baseband is.... failed...why? What i did wrong? - i remove around the ic the black gue with small heat and with dental pick - I made heating tape around the IC - i heated the ic... - then i can pull the IC up, but some pads stay on the ic.. - i see under microscope, on the ic and on the board is full black glue, how can i remove? i used flux, but some pads are going from board, when i solder the pads... i can't belive, any ic with too much pins can anybody reball, or what do i wrong???? |
 |
|
03-17-2013, 18:58
| #2 (permalink) |
| Junior Member  Join Date: May 2012
Posts: 22
Member: 1757890 Status: Offline Thanks Meter: 4 | maybe, did not have the temperature, and compound or solder wasn't melt. Did you use flux? Flux also plays a large role, when you reballing/removed/installing IC. Basically, i'm using 345-355 degress temperature, In extreme or rare event, it came to 380 degrees, but there is a risk of overheating and damage the element. |
| |
| The Following User Says Thank You to dekuort For This Useful Post: |
|
03-17-2013, 19:02
| #3 (permalink) |
| Junior Member Join Date: May 2012
Posts: 22
Member: 1757890 Status: Offline Thanks Meter: 4 | P.S. This IC very hard to be removed. If you have a dead motherboard 3g/3gs with baseband or other elements with compound, advice from me: traning, and traning. I learned this a long time, and that is tear off pads. |
| |
| The Following User Says Thank You to dekuort For This Useful Post: |
|
03-18-2013, 03:23
| #4 (permalink) |
| Junior Member Join Date: Feb 2013
Posts: 19
Member: 1891566 Status: Offline Thanks Meter: 1 | Im also practicing for this. I found that flux also help to soften the black glue. But it takes time. A long time. First i use 180c of heat with flux. Then leave the board for a few hours. Then reheat at 180c then use 320c to remove the ic successfully. Still need to practice a lot on this because so far i use a tweezer to hold the ic and try to wiggle it while it got heat up by the heat gun. In one case i actually cracked the ic because use too much force |
| |
|
| Bookmarks |
| |
|
|
Linear Mode
