HUAWEI P SMART "FIG LX1 in NEW SECURITY: SW version:FIG-LX1 8.0.0.170(C432) DOWNGRATED WITH FULL SUCCESS by HDE + FRP REMOVED + IMEI REPAIR WITHOUT TEST POINT AND MODIFIED FILES
here is the first attempt to unlock the phone frp, obviously not supported because of the new security!
Start read phone info from fastboot!
Read phone info done!
Model: FIG-LX1
MEID: 00000000000000
pESN: 00000000
IMEI: 866xxxxxxxx
Firmware ver.: FIG-LX1 8.0.0.170(C432
SN: XEDxxxxxxxxx
Phone info data backup saved to file C:\Users\salvo\Desktop\HDE ALL IN ONE 316(Flasher Included)\Backup\20190216_162051_866xxxxxxxxx.BAK
IMEI1:866xxxxxxxxxxxx
FB LockState: LOCKED
USER LockState: LOCKED
locked
Battery state: 3074mv
Erase FRP start
Connecting to server...
Connected!
Reading phone info...
Read phone info success!
Model: FIG-LX1
MEID: 00000000000000
pESN: 00000000
IMEI: 866xxxxxxxxxxx
Firmware ver.: FIG-LX1 8.0.0.170(C432
SN: XEDxxxxxxxxxx
Phone info data backup saved to file C:\Users\salvo\Desktop\HDE ALL IN ONE 316(Flasher Included)\Backup\20190216_162310_866xxxxxxxxxx.BAK
Reading Certify data...
Erase FRP fail
Not supported/unknown chipset!
1) we start to downgrade the firmware
Code:
Looking for a device in upgrade mode
COM190: Android Adapter PCUI (COM190)
COM191: DBAdapter Reserved Interface (COM191)
16/02/2019 16:59:23 Starting to write device in UPGRADE mode...
File to update: Figo-L11_8.0.0.129(C432)_Firmware_Android_8.0.0_EMUI_8.0.0_05014XUW.APP
Validating file...
Looking for attached port...
Preparing to write...
Writing partition: SHA256RSA...OK
Writing partition: CRC...OK
Writing partition: CURVER...OK
Writing partition: VERLIST...OK
Writing partition: PACKAGE_TYPE...OK
Writing partition: EFI...OK
Writing partition: XLOADER...OK
Writing partition: FW_LPM3...OK
Writing partition: FASTBOOT...OK
Writing partition: MODEMNVM_UPDATE...OK
Writing partition: TEEOS...OK
Writing partition: TRUSTFIRMWARE...OK
Writing partition: SENSORHUB...OK
Writing partition: FW_HIFI...OK
Writing partition: KERNEL...OK
Writing partition: RAMDISK...OK
Writing partition: RECOVERY_RAMDISK...OK
Writing partition: RECOVERY_VENDOR...OK
Writing partition: ERECOVERY_KERNEL...OK
Writing partition: ERECOVERY_RAMDISK...OK
Writing partition: ERECOVERY_VENDOR...OK
Writing partition: RECOVERY_VBMETA...OK
Writing partition: ERECOVERY_VBMETA...OK
Writing partition: DTS...OK
Writing partition: MODEM_FW...OK
Writing partition: VBMETA...OK
Writing partition: ODM...OK
Writing partition: CACHE...OK
Writing partition: SYSTEM...OK
Writing partition: CUST...OK
Writing partition: VENDOR...OK
Writing partition: VERSION...OK
Writing partition: PRODUCT...OK
Writing partition: USERDATA...OK
Software written
16/02/2019 17:17:53 Writing device finished OK
2) here is the phone with lower security
3) next phase block removal frp
Code:
Qualcomm and HiSilicon: *#*#2846579#*#*
MTK: *#*#14789632#*#*
Windows: ##2846579#
ProjectMenu
1.Background setting
2.USB ports setting
Select Manufacture mode
2019-02-16 17:21:09.604 Checking account
2019-02-16 17:21:09.614 Connecting to server...
2019-02-16 17:21:09.995 Connected!
Account:
Check success!
Credits left: 0
2019-02-16 17:21:46.637 Erase FRP start
2019-02-16 17:21:47.452 Connecting to server...
2019-02-16 17:21:47.833 Connected!
2019-02-16 17:21:49.001 Reading phone info...
2019-02-16 17:21:49.472 Read phone info success!
Model: FIG-LX1
MEID: 00000000000000
pESN: 00000000
IMEI: 866xxxxxxxxx
Firmware ver.: System 8.0.0.046(04AP
SN: XED
2019-02-16 17:21:49.516 Phone info data backup saved to file C:\Users\salvo\Desktop\HDE ALL IN ONE 316(Flasher Included)\Backup\20190216_172149_86XXXXXXXXXXX.BAK
2019-02-16 17:21:49.520 Reading Certify data...
2019-02-16 17:21:49.835 Reading Certify data success!
2019-02-16 17:21:49.838 Signing Certify data...
2019-02-16 17:21:52.241 Waiting for server responce (up to 45 seconds left)...
2019-02-16 17:21:56.286 Erase FRP done!
4)after removing frp, we can repair imei code
now we're done, the phone has been repaired in all, without testpoints and modified files !!!!!!!!