GSM-Forum - View Single Post - how to remove glue under mutimodule on T68

evilspell · 03-28-2003, 14:56

Hi,

I dont think that a chimical product exist (for Ericsson or Nokia glue)

To remove Components with glue , i use hakko 850 :
AIR : 3.5
heater: 3
between 250 ~280 C.,

first heat side of CCONT or Cobba..., till tin come out .
then continue to heat the component and use knife to pull up the compo but very slowly !

almost all glue will stay in component chip, PCB have few glue ,
then make AIR to 1, heater set to 2.5, then use knife to clean glue in PCB and that all!!!!

03-28-2003, 14:56	#6 (permalink)
evilspell No Life Poster Join Date: Apr 2001 Location: on the beach Posts: 1,995 Member: 4160 Status: Offline Thanks Meter: 1	Hi, I dont think that a chimical product exist (for Ericsson or Nokia glue) To remove Components with glue , i use hakko 850 : AIR : 3.5 heater: 3 between 250 ~280 C., first heat side of CCONT or Cobba..., till tin come out . then continue to heat the component and use knife to pull up the compo but very slowly ! almost all glue will stay in component chip, PCB have few glue , then make AIR to 1, heater set to 2.5, then use knife to clean glue in PCB and that all!!!! Last edited by evilspell; 03-28-2003 at 15:03.