[Mobajer]

Hello !

i am looking for people who solders NVIDIA, ATI and other laptop chipsets with hot air rework stations.

i am using ok industries 3500 bga rework station. (metcal)



but lot of chipsets are overheated when desoldering with original lead fre solder from factory. for example:

to desolder chip GF-GO7600-H-N-B1 (DV9000) 3.5cm x 3.5cm i use homemade nozzle 3.7cm x 3.7cm

not to damaged motherboard, need to use profile:

260c from bottom (±180c mesured on pcb)

soak from top 150sec 230c

peak 180sec 360c.

but on the end i hear "pop" sound and i see crack around the chipset crystal.

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If i take new chipset and reball it with solder balls Sn63Pb37

then all ok, from bottom 260c, from top 230c and solder melts.

i need advices. thank you all...