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Go Back   GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > Nokia > Nokia Hardware & Hardware Repair


Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section.

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Old 01-07-2011, 04:11   #1 (permalink)
HUM
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..::can someone experience reballing double ic of 7230 and x3::..


can someone experience reballing double ic of nokia 7230 and x3

please share here

bcoz i didnt find stencil for this double ic
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Old 01-08-2011, 04:45   #2 (permalink)
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some special tools u need
just see
Attached Images
File Type: jpg TOOL.jpg (24.2 KB, 112 views)
File Type: jpg lead ball9.jpg (24.8 KB, 87 views)
File Type: jpg S1007643181.jpg (8.4 KB, 95 views)
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Old 01-08-2011, 05:30   #3 (permalink)
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helloo sir u cant reball this double ic.we just rehot or reflow this ic...................
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Old 01-08-2011, 06:25   #4 (permalink)
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nothing is impossible under the blue sky brother
i have done this many times
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Old 01-08-2011, 06:33   #5 (permalink)
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Quote:
Originally Posted by suraj9860607689 View Post
helloo sir u cant reball this double ic.we just rehot or reflow this ic...................
boss,
you sure ?
dual layered smd reball work is totally impossible task ?
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Old 01-08-2011, 06:35   #6 (permalink)
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Quote:
Originally Posted by QADRI View Post
nothing is impossible under the blue sky brother
i have done this many times
Can u please upload the process with pic for us???
Thanks in Advance.
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Old 01-08-2011, 12:44   #7 (permalink)
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2 different size of balls under double ic of x3,7230
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Old 11-23-2011, 19:35   #8 (permalink)
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Dear it's not easy and it's not difficult.
just use ur concentration
i had made double ic
this is the procejure
-remove 1st ic and then remove 2nd ic and clean board from solder
- then also clean ic ball from solder and 2nd ic also clean from solder both side
be sure that both ic and board clean from solder and no balls remain on component
then take ic plate with BGA paste
and make re-ball on both ic through ic plate.
remember that don't make re-ball on 2nd ic upper side because when u put 1st ic on 2nd ic then it can't be proper adjust , same like mother board
only make re-ball on 1st ic and 2nd ic downside.
that's it
if any problem then you can reply here.
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Old 11-23-2011, 19:47   #9 (permalink)
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For me no need of any kind of BGA stencil http://forum.gsmhosting.com/vbb/f148...g-way-1346110/
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Old 11-23-2011, 21:39   #10 (permalink)
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Mates u don't need to make thinks more complicated , u just need to remove both ic's , after that is easy to make cpu balls .
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